[China Briefing] China Spends 27 Trillion Won on Semiconductor Self-Sufficiency
e4ds News Summary of Greater China ICT News - June 28, 2021 [China Briefing]: ◇China poured approximately 27 trillion won over one year into semicondu…
2021.06.28 by 이수민 기자
[China Briefing] Chinese Foundries to Produce 14nm Next Year? Etc.
e4ds News China ICT Briefing - June 25, 2021 [China Briefing]: ◇Chinese foundries to produce 28nm chips this year, 14nm chips next year ◇MediaTek 4nm …
2021.06.25 by 이수민 기자
KLA Unveils Four Equipment to Increase Automotive Semiconductor Yield and Reliability
Automotive semiconductor manufacturers must identify and reduce reliability defects in the factory before chips are assembled into vehicles. KLA offer…
2021.06.25 by 이수민 기자
Intel's entry into the foundry market is negative for Korea.
Due to accelerated semiconductor self-sufficiency driven by the U.S. reshoring policy, the accelerated collaboration between foundries and fabless com…
2021.06.24 by 배종인 기자
[China Briefing] Chinese RISC-V chips are catching up with Arm performance, etc.
e4ds News Greater China ICT Briefing - June 24, 2021 [China Briefing]: ◇Chinese Academy of Sciences announces RISC-V processor 'Xiangshan', launches i…
2021.06.24 by 이수민 기자
[China Briefing] US FCC Strengthens Regulations on Chinese Companies
e4ds News China ICT Briefing - June 21, 2021 [China Briefing]: ◇US FCC refuses certification for products from five Chinese companies including Huawei…
2021.06.21 by 이수민 기자
TSMC Breaks Ground on US Plant, $12 Billion Investment Begins in Full Swing
TSMC has begun construction on its U.S. facility, accelerating a $12 billion investment. The plant is targeting completion in 2024 and plans to produc…
2021.06.17 by 배종인 기자
Key Foundry and Above Semiconductor Join Forces for Automotive Semiconductor
Keyfoundry provides Above Semiconductor with a second-generation flash memory embedded 0.13 micron BCD (Bipolar-CMOS-DMOS) process suitable for automo…
2021.06.17 by 배종인 기자
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[China Briefing] Xiaomi Patents Curved Fingerprint Recognition
e4ds News China ICT Briefing - June 17, 2021 [China Brief] : ◇Xiaomi to add fingerprint unlock feature on curved screen edge ◇PSMC begins 2023 order n…
2021.06.17 by 이수민 기자
[China Briefing] TSMC Considers Building Packaging Fab in U.S., etc.
e4ds News China ICT Briefing - June 15, 2021 [China Briefing] : ◇TSMC reviewing construction of chip packaging fab in the US ◇Huawei "HiSilicon will c…
2021.06.15 by 이수민 기자
KAIST Boosts Communication Chip Performance with Semiconductor 3D Stacking Technology
A research team led by Professor Kim Sang-hyun from the Department of Electrical and Electronic Engineering at KAIST has developed monolithic three-di…
2021.06.15 by 이수민 기자
[China Briefing] TSMC to Build Japanese Fab Near Sony, etc.
e4ds News China ICT Brief - June 11, 2021 [China Briefing]: ◇TSMC to Build Fab in Kumamoto, Japan "Plans to Locate Adjacent to Sony" ◇China Unicom Gan…
2021.06.11 by 이수민 기자
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Samsung Electronics Develops 8-Nan RF Process Technology
Samsung Electronics is aggressively pursuing the 5G communication semiconductor market from sub-6GHz to millimeter wave (mmWave) by providing RF chips…
2021.06.09 by 배종인 기자
[China Briefing] China Strengthens Foundry Based on Domestic Market, etc.
e4ds News China Region ICT Update - June 8, 2021 [China Briefing]: ◇China rises to world's No. 1 semiconductor consumer, driven by indigenous electron…
2021.06.08 by 이수민 기자
[China Briefing] Taiwan's Semiconductor Industry on High Alert Due to COVID-19
e4ds News Chinese ICT Updates - June 7, 2021 [China Briefing]: ◇Semiconductor plant shutdowns compound chip shortage crisis ◇SMIC "expanding to 28nm,"…
2021.06.07 by 이수민 기자