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[EDA Great Transformation ①] The Era of AI Designing Chips…EDA Competition Shifting from 'Speed' to 'Trust'
As 'self-verifying' designs in which AI directly executes, validates, and corrects EDA tools become widespread, the core of EDA competition is shiftin…
2026.08.12 by 배종인 기자
Reducing '650V Over-Design'…400V SiC Targets Power Semiconductor Niche Market
Infineon's second-generation 400V and 440V class CoolSiC MOSFET reduces the 'over-design' that occurred when using existing 500-650V devices, enabling…
2026.08.10 by 배종인 기자
[Serial Planning-The SDV Era Has Arrived③] The Real Brain War in Automobiles, the Winner Will Be Decided in 2027
Through the case of The all new AVANTE, the core of the SDV industry in 2026 is that 'experience-layer SDV' is mainstream. Infotainment, app, and AI-c…
2026.08.07 by 배종인 기자
[Series Planning-The SDV Era Has Arrived②] Updating Vehicles, What Do Consumers Pay For?
The SDV benefits of the Elantra are limited to the experience layer: OTA of major controllers, app selection options, and AI-based voice control. Mean…
2026.08.07 by 배종인 기자
[Serial Planning-The SDV Era Has Arrived①] Is the Elantra Really SDV?... 'Platform's Winning Move' Laid Before the Car
The all-new Elantra applied Pleos Connect, App Market, Gleo AI, and OTA as standard across all trim levels, but did not equip the central-control E/E …
2026.08.07 by 배종인 기자
Domestic AI semiconductors, moving beyond demonstration into everyday use...Can they shake 'Nvidia's dominance'?
Domestic AI semiconductors are advancing beyond the research and pilot stage and being deployed in real environments including public services, indust…
2026.08.07 by 배종인 기자
Dual FOC: The Solution to Breaking Through Robot Joint Miniaturization and Multi-Axis Control Complexity
STMicroelectronics (ST, STMicroelectronics) solves both robot joint miniaturization and multi-axis control complexity through dual FOC. It integrates …
2026.08.06 by 배종인 기자
“Linux and Arduino on one board”… Arduino UNO Q lowers the barrier to entry for edge AI development
Arduino UNO Q is a hybrid board combining a Linux MPU and Arduino MCU. It enables easy implementation of edge AI development such as sensor control, w…
2026.07.31 by 배종인 기자
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The Era of 1 Million GPUs: Bottlenecks Are 'Wiring,' Not Computation… CPOs Are Changing the Data Center Landscape
AI data centers face data movement as a bottleneck rather than GPU computation. CPO (Co-Packaged Optics), which packages switch ASICs and optical engi…
2026.07.31 by 배종인 기자
"Matter cameras are not simply devices registered in smart home apps"
On the 23rd, at the 'Matter Chipset Partner Development and Demo Day', Oh Tae-sung, Director at IDK Technology, introduced ESPRESSIF's Matter camera s…
2026.07.31 by 배종인 기자
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'Matter' Lowers the 'Start Barrier' to Smart Homes
Kim Young-chul, Director at NXP, presented on the topic of 'NXP Matter Solutions - Everything that Matters' at the 'Matter Chipset Partner Development…
2026.07.31 by 배종인 기자
Samsung Electronics Galaxy Unpacked 2026: AI, Proprietary Chips, and Ecosystems Set a New Beginning
Samsung Electronics unveiled three foldable devices—the Galaxy Z Fold8 Ultra, Galaxy Z Fold8, and Galaxy Z Flip8—at Galaxy Unpacked 2026 held at Old B…
2026.07.31 by 배종인 기자
Galaxy Z Fold 8 Shifts Direction from 'Bigger Fold' to 'More Fit'
Samsung Electronics unveiled its next-generation foldable phone "Galaxy Z Fold8," recalibrating the center of gravity in its foldable strategy. While …
2026.07.31 by 배종인 기자
The competitiveness of the lighting industry hinges on light source control semiconductor platforms.
The competitive axis in the LED lighting market is shifting from simple energy savings to power quality, sensing, connectivity, and design platforms. …
2026.07.31 by 배종인 기자
Shipments Declined While Profits Exploded: The 'Memory Paradox' That Shook the Smartphone Market
The global smartphone market entered a sharp adjustment phase in the second quarter of 2026. While shipment volumes declined, prices increased, and th…
2026.07.31 by 배종인 기자