Ansys Korea held an Executive Forum to share changes in industry-specific product development environments and engineering response strategies resulting from the spread of AI. At this forum, the first held in Korea since the integration of Synopsys and Ansys, the direction of integrated engineering connecting semiconductor design to system verification was discussed as a major agenda item.

Ansys Korea held the 'Ansys Executive Forum 2026' on the 11th. Approximately 50 executives and managers from major domestic companies and institutions, including Samsung Electronics, SK Hynix, Hyundai Motor Company, and LG Energy Solution, attended the event.

This forum was organized to discuss response strategies for companies in the semiconductor, mobility, and aerospace and defense sectors amidst the increasing complexity of product development due to the spread of AI. The main agenda focused on next-generation industrial technologies such as AI data centers, high bandwidth memory (HBM), software-defined vehicles (SDV), digital twins, and agentic AI, as well as the engineering methodologies that support them.

At the event, the 'Silicon to Systems' strategy was introduced, leveraging the integration of Synopsys and Ansys to connect the entire process from semiconductor design to system verification and operation. Moon Seok-hwan, APAC Vice President of Simulation & Analytics (S&A) at Synopsys, presented co-design, digital twins, and agentic AI as key elements of engineering innovation.

With the expansion of AI infrastructure, issues regarding semiconductor packaging and thermal management have also emerged as major topics of discussion. Since electrical, thermal, and mechanical properties must be considered together in the design of AI data centers, HBM, and next-generation semiconductors, multiphysics simulation and AI-based engineering technologies have been proposed as key solutions.

In the mobility sector, software-centric product development trends, such as SDVs and humanoid robots, were discussed. In the increasingly complex product development process, integrated simulation and engineering automation have been introduced as means to increase development efficiency.

So Kyung-shin, CEO of Synopsys Korea, explained the direction of cooperation with the domestic semiconductor industry and mentioned the importance of an integrated engineering environment that links Electronic Design Automation (EDA), semiconductor IP, and multiphysics simulation capabilities.

In a special lecture, Dr. Kim Ji-yoon examined the U.S. strategy for technological, energy, and financial hegemony and the trends in the restructuring of global supply chains, and presented industrial strategic perspectives that Korean companies should consider.

Vice President Moon Seok-hwan stated, “AI is accelerating the pace of innovation across industries and bringing about fundamental changes in product development and operational methods,” adding, “Based on the integrated capabilities of Synopsys and Ansys, we will support customers in innovating more quickly and efficiently, from semiconductors to systems.”