ACM Research to Launch 'Bevel Etch' Etching Equipment in Q3
To improve wafer yield and reduce chemical use
Edge etching and cleaning capabilities in a single device


In the IC manufacturing process, wafer edge peeling, particles, and residues are causing wafer edge yield degradation in 3D NAND, DRAM, and advanced logic processes. To address this, the need to improve the overall process yield is growing.

ACM Research released the 'Bevel Etch' etching equipment on the 26th. The new equipment uses a wet etching method to remove various dielectric, metal, and organic material films and particulate contaminants from the wafer edge. This minimizes the impact of edge contamination on subsequent process steps and improves yield during chip manufacturing.

“Bevel etching offers higher performance and uses less chemicals than conventional dry equipment,” said David Wang, CEO of ACM Research. “It enables precise and efficient wafer centering, which can lead to precise edge etching and improved yields.”

Previously, semiconductor manufacturers used a dry bevel etching process to remove edge bleeds and contaminants. The wet method avoids the risk of arc discharge and silicon damage that can occur in the dry process. 1~7mm variable wafer edge film etching/cutting accuracy, good uniformity and controllable etching, and reduced chemical usage contribute to cost reduction.

The first mass-produced bevel etch equipment is expected to be delivered to a Chinese logic manufacturer in the third quarter.