Samsung Electronics is expanding its supply of high-performance semiconductors with next-generation semiconductor packaging technology.

Samsung Electronics announced on the 11th that it has developed the 'H-Cube (Hybrid-Substrate Cube)', a 2.5D packaging solution for high-performance semiconductors, through innovation in semiconductor packaging technology.

Following its existing 2.5D packaging solution I-Cube, Samsung Electronics has now secured the industry's highest specification 'H-Cube' that can accommodate six or more high-bandwidth memories (HBM), enabling it to provide customized semiconductors tailored to each application market, such as data centers, AI, and networks, in various types of packages to meet customer needs.

Samsung Electronics' 'H-Cube' is a 2.5D packaging solution that places logic such as CPU and GPU and HBM on a silicon interposer, and is used for high-spec semiconductors for HPC, data centers, and networks.

'H-Cube' is a two-stage hybrid packaging structure that uses an auxiliary substrate that allows for large-area implementation under the main substrate where high-spec characteristics can be easily implemented, and has the advantage of being able to efficiently mount six or more HBMs along with logic.

Samsung Electronics has reduced the gap between the solder balls that electrically connect the main board and the auxiliary board by 35% compared to the existing one. It minimizes the size and overcomes the difficulty of manufacturing large-area substrates due to the increasing number of HBMs installed.

Additionally, a secondary board was added under the main board to ensure connectivity with the system board.

Samsung Electronics also applied chip analysis technology to increase the reliability of this solution by stacking multiple logics and HBMs while supplying stable power to the chip and minimizing signal loss or distortion.

“H-Cube is the result of a long-term collaboration between Samsung Electronics, Amkor Technology, and Samsung Electro-Mechanics, and is the optimal solution for high-spec semiconductors that require integration of a large number of chips,” said Kang Moon-soo, executive director of the Market Strategy Team at Samsung Electronics’ Foundry Business Division. “Samsung Electronics will continue to provide various packaging solutions that overcome technological limitations through close collaboration with foundry partners.”

“Samsung Electronics and Amkor Technology have successfully developed the H-Cube solution and have overcome the challenges of implementing semiconductor integration technology required in the HPC and AI markets,” said Jinyoung Kim, managing director of Amkor Technology’s Technology Research Lab. “The successful collaboration between a foundry and an OSAT (operating system for semiconductor packaging and test) is very significant.”