EV Group (EVG), a specialist in wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is introducing a new design of its 200mm resist processing equipment, building on the excellent performance of its previous generation by increasing module capacity for greater productivity.

EVG announced today the launch of the EVG®150 automated resist processing system, the next-generation 200mm product in its lithography solutions portfolio.

The redesigned EVG150 platform features up to 80 percent higher productivity, superior versatility, and a 50 percent smaller footprint compared to previous-generation platforms.

As a general-purpose platform, it enables reliable, high-quality coating and developing processes, making it applicable to a wide range of devices and applications, including advanced packaging, MEMS, RF, 3D sensing, power semiconductors, and photonics. The new equipment meets the demanding needs of both high-volume production and industrial development with excellent productivity, flexibility and repeatability.

Silicon Austria Labs, a world-leading electronic based systems (EBS) research center, is the first customer for the next-generation EVG150 system.

“We work with leading manufacturers to develop technologies that are laying the foundation for Industry 4.0, the Internet of Things (IoT), autonomous driving, cyber-physical systems (CPS), artificial intelligence (AI), smart cities, smart energy and smart healthcare,” said Dr. Mohssen Moridi, head of Microsystems Research at Silicon Austria Labs. “EVG’s next-generation EVG150 resist processing system provides the flexibility to help our development customers accelerate EBS innovation and set the stage for high-volume implementation of new processes and products.”

The next-generation EVG150 for 200mm substrates retains the industry-leading attributes of the previous generation platform. These include a fully automated platform with customizable modular configurations for spin and spray coating, development, bake and cool processes; EVG’s proprietary OmniSpray® technology for conformal coating of extremely complex geometries; sophisticated and proven robotic handling with dual end-effector capability to achieve consistently high productivity; and wafer edge handling and the ability to handle warped, twisted or thin wafers.

“Resist and patterning processes are among the most repetitive processes in semiconductor manufacturing,” said Dr. Thomas Glinsner, corporate technology director at EVG. “EVG has many years of expertise in lithography and process areas including spin and spray coating to deliver solutions that meet our customers’ most demanding needs,” he said. “The next-generation EVG150 system builds on that experience by designing a general-purpose platform to deliver new levels of productivity and cost benefits, while providing unprecedented flexibility to meet the resist process needs of a wide range of applications.”