Infineon Technologies (Korea CEO Seung-Soo Lee) and Schweizer Electronic AG are joining hands to develop chip embedding solutions, contributing to improving electric vehicle driving range and reducing system costs.

Infineon announced on the 27th that it is collaborating with Schweitzer to further increase the efficiency of silicon carbide (SiC)-based chips.

The two companies are developing a chip embedding solution that embeds Infineon’s 1200V CoolSiC™ chips directly into the PCB, a technology that will increase the driving range of electric vehicles and reduce total system costs.

The two companies have already demonstrated the potential of this new approach: Schweitzer’s innovative p²Pack® solution, which allows power semiconductors to be embedded on a PCB, has enabled the integration of 48 V MOSFETs into the PCB, resulting in a 35 percent increase in performance.

“Our common goal is to take automotive power electronics to the next level,” said Robert Hermann, head of Infineon’s Automotive High Voltage Discrete and Chip product line. “The low inductance environment of the PCB enables clean and fast switching. “Chip embedding technology combined with the leading performance of our 1200 V CoolSiC™ devices enables highly integrated, high-efficiency inverters that reduce overall system cost,” he said.

“Using Infineon’s 100 percent electrically tested standard cells (S-Cells) enables us to achieve high overall yields in our p²Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic. “The fast switching characteristics of the CoolSiC chips are optimally supported by the low inductance achievable with the p²Pack. This increases efficiency and improves reliability in power conversion devices such as traction inverters, DC-DC converters and onboard chargers.”