SK Hynix has been awarded direct subsidies of $450 million, loan support, and tax benefits of up to 25% for its investment in the United States.

The U.S. Department of Commerce announced on the 6th that it had signed a Preliminary Memorandum of Terms (PMT) that provides up to $450 million in direct subsidies and $500 million in loans in accordance with the U.S. Semiconductor Act in relation to SK Hynix's investment in a semiconductor packaging production facility in Indiana.

In addition, the U.S. Treasury Department has decided to provide tax benefits of up to 25% of the amount SK Hynix invests in the U.S.

In this regard, SK Hynix expressed its deep gratitude for the U.S. government’s support and said it would do its utmost to comply with the remaining procedures until the subsidy is finalized.

In addition, SK Hynix said it will proceed with construction work to ensure smooth mass production of AI memory products at its Indiana production base and will do its best to contribute to the activation of the global semiconductor supply chain through this.

Earlier in April, SK Hynix announced plans to invest $3.87 billion in building an advanced packaging production facility in Indiana, USA, creating approximately 1,000 jobs and cooperating with local research institutes such as Purdue University on semiconductor research and development.