EV Group (EVG), a leader in advanced semiconductor manufacturing and chip integration technology, is driving innovation in 300mm MEMS manufacturing technology, establishing a platform to showcase innovative devices and products in the MEMS industry.

EVG recently announced its next-generation GEMINI® automated wafer bonding system for 300mm wafer manufacturing.

This announcement is expected to advance bonding quality and yield of Micro-Electro-Mechanical Systems (MEMS) devices manufactured on large wafers.

Introducing a newly designed high-pressure bonding chamber, the GEMINI system builds on EVG’s global standard for high-volume-manufacturing (HVM) wafer bonding technology.

This enables efficient hermetic sealing and vacuum encapsulation required for MEMS devices using metal-based bonding technology.

EVG already supplies its equipment to major MEMS manufacturers and is highly regarded.

According to market research firm Yole Group, the MEMS market is expected to grow from $14.6 billion in 2023 to $20 billion in 2029.

This growth is driven by MEMS devices such as inertial sensors and microphones used in consumer wearable devices such as smartwatches and true wireless earbuds (TWS). Driven by increasing demand.

These MEMS devices require protection from the external environment and a controlled operating environment, making high-performance bonding technologies essential.

To respond to these market changes, the MEMS manufacturing industry is transitioning from existing 200mm wafer manufacturing to 300mm wafer manufacturing.

On the other hand, the transition to 300mm poses many technical challenges, such as requiring greater bonding strength.

EVG has addressed these challenges with its newly designed GEMINI system, ready to meet the manufacturing needs of current and future generations of MEMS devices.

The GEMINI platform supports up to four bonding chambers and offers adjustable bonding pressure (up to 350 kN), high vacuum and high pressure (2,000 mbar abs.).

It also maintains the strengths of the existing platform, such as automatic optical alignment and flexible module configuration.

“EVG has been supplying production wafer bonding systems for the MEMS industry for over 30 years, supporting our customers on their innovation journey,” said Dr. Thomas Glinsner, EVG’s Corporate Technology Director. “Our next-generation GEMINI system will set a new standard for MEMS manufacturing.”