Deca Technologies, a global leader in semiconductor packaging technology, has entered into a strategic partnership with IBM to expand high-density fan-out interposer manufacturing in North America.

Decca announced today that it has signed an agreement to implement Decca’s M-Series™ and Adaptive Patterning technologies at IBM’s advanced packaging facility in Bromont, Quebec, Canada.

Accordingly, IBM plans to build a mass production manufacturing line centered on Decca's M-Series Fan-Out Interposer Technology (MFIT™).

IBM's Bromont facility is one of North America's largest semiconductor assembly and test hubs and has been driving packaging technology innovation for over 50 years.

IBM’s recent major investment has expanded the facility, further strengthening its role in supporting advanced packaging technologies essential for AI, high-performance computing (HPC), and data center applications.

Through its collaboration with Deca, IBM plans to further advance its next-generation packaging capabilities and expand its global supply chain for high-performance chiplet integration.

Deca’s M-Series platform is the most widely deployed fan-out packaging technology, with over 7 billion units shipped to date.

MFIT is based on a proven platform and provides the final processor and memory of the chip.It provides high-density, low-latency connectivity between chiplets by applying embedded bridge die for re-integration.

It also improves signal integrity, provides design flexibility, and enhances scalability to meet the needs of AI, HPC, and data center equipment.

“Advanced packaging and chiplet technology are essential to fast, efficient computing solutions in the AI era,” said Scott Sikorski, general manager of IBM’s Chiplet and Advanced Packaging business development. “Decca’s technology will position IBM’s Bromont facility at the forefront of innovation, helping us deliver faster time to market and enhanced AI performance for our customers.”

“IBM has a deep history in advancing semiconductor technology and advanced packaging, making them the perfect partner to bring Deca’s MFIT to volume production,” said Tim Olson, Deca founder and CEO. “We are excited to work with IBM to bring Deca’s interposer technology to the North American market.”

This collaboration is driven by the two companies’ shared goal of advancing next-generation semiconductor packaging technology. By combining Decca’s proven technology with IBM’s advanced manufacturing capabilities, the two companies will continue to drive innovation for high-performance chiplet integration and advanced computing systems.