인피니언 테크놀로지스(Infineon Technologies)가 22일 코엑스에서 한국에서 최초로 글로벌 혁신 생태계 행사인 ‘옥토버테크(Octover Tech)’를 개최하고, 기자간담회를 통해 디지털화와 탈탄소화를 위한 인피니언의 기술 혁신 및 국내 기업 협력 현황을 발표했다. 이날 행사에서는 LG전자, 한화 NxMD와의 협력 내용도 발표됐다.

▲ Andreas Ursitz, Chief Marketing Officer at Infineon, presents a 300mm GaN wafer.
300mm GaN, Maximizing Cost Efficiency and Improving Energy Efficiency Across Industries
Hanwha·LG MOU, Accelerate SDV Transition to Maximize SDV Safety and Efficiency
“Infineon has the will and vision to continuously drive decarbonization and digitalization. We will pursue these two goals together with our customers and partners in Korea.”
Infineon Technologies held a press conference at COEX on the 22nd and announced Infineon's technological innovations and domestic corporate cooperation status for digitalization and decarbonization.
Andreas Ursitz, Chief Marketing Officer of Infineon, and Seungsoo Lee, CEO of Infineon Technologies Korea, who made the announcement that day, stated that Infineon is leading the way in decarbonization and energy efficiency through next-generation semiconductor technology.
Infineon, the world leader in automotive semiconductors, power semiconductors and microcontrollers, has been driving decarbonization and digitalization for 25 years and has succeeded in applying new semiconductor technologies in various fields such as automotive, industrial and consumer electronics.
Korea is recognized as one of the most innovative engineering communities in the world, and through its collaboration with Infineon, it is further accelerating decarbonization and digital transformation.
Andreas Ursitz, Chief Marketing Officer at Infineon, said, “As a global market leader in power semiconductors, Infineon is developing innovative semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) and is focusing on building a sustainable technology ecosystem in the global market, including Korea.”
Infineon is developing next-generation power semiconductor solutions that maximize energy efficiency through silicon carbide (SiC) and gallium nitride (GaN) technologies.
In particular, the application of SiC·GaN-based semiconductors is expanding in various industries such as automobiles, data centers, smart buildings, robotics, and drones, making it possible to implement smaller and more powerful electronic products.
Ranked first in the power semiconductor marketInfineon is bringing about innovative changes to next-generation transportation, including electric vehicles, by developing high-efficiency semiconductors using SiC and GaN technologies.
In particular, the world's first 300mm wafer-based gallium nitride power semiconductor maximizes cost efficiency and contributes to improving energy efficiency across industries.
The semiconductor manufacturing process also consumes a lot of resources and energy and generates carbon dioxide (CO₂) emissions.
Accordingly, Infineon has set a goal of achieving carbon neutrality by 2030 and is building a sustainable manufacturing process.
Infineon's current semiconductor technology saves 45 times more CO₂ than the CO₂ emissions generated during manufacturing, which is equivalent to the annual CO₂ emissions of 200 million European households.
Based on these efforts and technological innovations, Infineon has established itself as a key company leading carbon neutrality and energy innovation in the global industry, going beyond a simple semiconductor manufacturer.

▲ Andreas Ursitz, Chief Marketing Officer of Infineon, and Seungsoo Lee, CEO of Infineon Technologies Korea, answer reporters' questions at a press conference.
This year, Infineon held its first global innovation ecosystem event, ‘Octover Tech’, in Korea.
OctoberTech is a technology platform held in key global regions where innovators, engineers and trusted partners gather to discuss future technologies.
Through this, Infineon is contributing to the Korean industry.We are supporting you to become more competitive in the global market.
Infineon announced two meaningful collaborations at this year’s October Tech.
First, we will cooperate with LG Electronics to maximize the safety and efficiency of SDV (Software Defined Vehicle) and accelerate the transition to SDV.
This collaboration aims to develop safety and security solutions for xDC (Cross Domain Controller) platforms, Zone Controllers, and HPC (High Performance Computing) platforms by leveraging Infineon’s advanced semiconductor technologies.
Infineon and LG Electronics will develop the xDC (Cross Domain Controller) platform based on the AURIX™ microcontroller for SDV innovation.
The platform will further enhance vehicle performance and safety by integrating data across various domains, including in-vehicle infotainment, autonomous driving (AD)/advanced driver assistance systems (ADAS), and vehicle motion control (VMO), and providing optimized data routing.
The two companies also plan to develop cost-effective and scalable zone control units using Infineon’s TRAVEO™ T2G microcontroller. Zone control units manage specific physical areas within a vehicle and support the integration of sensors, actuators and peripherals.
It also performs various roles, including local gateway function over an Ethernet backbone, multi-domain (x-domain) data hub role, service-oriented architecture (SOA) support, smart power distribution (SPD) and protection functions.
Additionally, the jointly developed HPC platform will use Infineon’s AURIX™ microcontroller to enhance the safety and security of SDV.
In addition, we signed a partnership with Hanwha NxMD (CEO Jang Se-young) to strengthen cooperation in the field of automotive wireless connectivity solutions.
This agreement is expected to be an important milestone in meeting the requirements of increasingly complex and advanced automotive digital architecture and responding to future challenges.
Hanwha NxMD’s wireless communication module featuring Infineon’s AIROC automotive wireless solution CYW88570XR was successfully installed in the CDC based on its mobile expertise.
This is the result of synergy between Infineon’s advanced Wi-Fi + Bluetooth combo solution and Hanwha NxMD’s outstanding wireless communication module solutions and manufacturing expertise.
Infineon's AIROC Wi-Fi-Bluetooth combo solution provides cutting-edge wireless connectivity technology for next-generation connected vehicles.
The solution supports in-vehicle infotainment and telematics systems.
Wi-Fi 5/6/6E, RSDB (simultaneous dual band), simultaneous use of Wi-Fi and Bluetooth enables high-speed data streaming and multi-device synchronization. It also offers flexible integration options, including Android and Linux compatibility.
Through this partnership, both companies will expand their business and explore additional collaboration opportunities. In particular, by making Hanwha NxMD’s wireless communication module portfolio available on the Infineon website, they plan to lay the foundation for quickly supplying related solutions to partners in need.