DeepX (CEO Nok-won Kim), an ultra-low-power on-device AI semiconductor company, announced that it signed a strategic business agreement (MOU) with global server solution company AIC Inc. at Computex Taipei 2025 and will begin jointly developing AI servers for the edge computing market.

On May 21, DeepX held a signing ceremony with AIC at the AIC booth and unveiled a next-generation AI server solution that integrates DeepX's low-power, high-performance AI semiconductors with AIC's industrial server platform.

This solution was developed in a form optimized for various on-device environments such as smart retail, industrial automation, intelligent video security systems, and edge data centers, based on its strengths of high-performance computing capability and ultra-low power and miniaturization.

This collaboration was carried out in the commercialization preparation stage to reflect the needs of major global customers, and in particular, AIC's CB201-CP model equipped with eight of DeepX's DX-H1 PCIe cards is being verified as an on-premise AI server in cooperation with a major domestic IT company.

In the future, the two companies plan to jointly develop AI hardware reference architecture and verification systems and supply them to global SI (System Integrator) and OEM partners.

Through this partnership, DeepX is also exploring the possibility of entering the media and entertainment market, and is looking into AIC’s global manufacturing and systemsWe are promoting the expansion of the global ecosystem of ultra-high-efficiency AI semiconductors by leveraging our integrated capabilities.

“Demand for power efficiency and compact form factors is rapidly increasing in the AI server market,” a DeepX official said. “Through our collaboration with AIC, we will provide optimized AI server solutions to customers in various markets, including security, industry, and edge.”