As the demand for power in data centers rapidly increases along with the development of AI technology, Texas Instruments and NVIDIA have joined hands to build AI data center power infrastructure.

TI announced on the 27th that it is developing a high-efficiency 800V DC power distribution system in collaboration with NVIDIA.

This new architecture is attracting attention as a key technology that will increase the scalability and reliability of future AI infrastructure.

Currently, the power consumption per rack of a data center is around 100kW, but it is expected to exceed 1MW in the future due to the development of AI.

The existing 48V power distribution method had physical limitations due to the large amount of copper required, but the 800V architecture can dramatically improve power density and conversion efficiency.

Combining TI’s power management research team with NVIDIA’s AI expertise, the new 800V architecture ensures high energy efficiency while minimizing the increase in size and weight of data center racks.

“With the rapidly increasing power demands of AI data centers, TI and NVIDIA are working together to deliver optimal power conversion technology,” said Jeffrey Moroney, director of power management R&D at TI’s Kilby Labs.

Gabriele Gola, Vice President of Systems Engineering, NVIDIAThe city “emphasizes the importance of semiconductor power systems for building high-performance AI infrastructure,” he said, adding that the 800V architecture will support the efficient operation of large-scale AI data centers.

The 800V high-voltage DC power distribution system developed in collaboration between TI and NVIDIA is expected to become an essential element for the continued growth and expansion of future AI data centers.