Sales 22.232 trillion won, 35% ↑ Operating profit 9.2129 trillion won, 69% ↑
Increased demand for AI, driving technological competitiveness, securing 17 trillion won in cash assets
SK Hynix has established itself as a key player in the semiconductor market, posting its best-ever quarterly performance in the second quarter of 2025.
SK Hynix announced its business performance for the second quarter of 2025 through a public disclosure on the 24th. According to this, the company recorded sales of KRW 22.232 trillion based on consolidated financial statements, up 35.4% year-on-year, and operating profit of KRW 9.2129 trillion (operating profit margin of 41%), up 68.5% year-on-year. Net income increased 69.8% year-on-year to KRW 6.9962 trillion (net profit margin of 31%).

▲SK Hynix 2025 Q2 Business Performance (Unit: 100 million won, %)
This is an all-time record, surpassing the previous quarter and the fourth quarter of last year, and is analyzed to be mainly due to the increase in memory demand due to the expansion of the global AI industry.
SK Hynix drove sales growth by expanding shipments of high-performance DRAM and NAND flash products suitable for AI.
In particular, full-scale sales of HBM3E 12-layer products and increased demand for NAND in various applications contributed significantly to performance.
“Big Tech’s investment in AI and the construction of sovereign AI are driving demand for high-performance, large-capacity memory,” the company said.
As of the end of the second quarter, cash assets increased by KRW 2.7 trillion from the previous quarter to KRW 17 trillion, and net borrowings decreased by KRW 4.1 trillion, significantly improving financial soundness. The debt ratio and net debt ratio recorded stable levels of 25% and 6%, respectively.
SK Hynix plans to continue strengthening its leadership in the AI memory market in the future.
Based on the mass production capacity of HBM3E, we plan to grow HBM products by approximately two times compared to the previous year, and we are also preparing to supply HBM4 according to customer demand.
Additionally, we plan to launch LPDDR modules for servers within the year, and introduce 24Gb products following the current 16Gb capacity GDDR7.
The NAND division plans to expand sales of QLC-based high-capacity SSDs (eSSDs) and build a product portfolio using 321-layer NAND technology. Through this, it is expected to respond to future increases in market demand and enhance profitability.
CEO Song Hyun-jong emphasized, “We will simultaneously lead customer satisfaction and market growth by launching products with the highest quality and performance required by the AI ecosystem in a timely manner,” and “We will proactively respond to demand through preemptive investment to leap forward as a full-stack AI memory provider.”