Infinitesima, a global leader in semiconductor metrology technology, is moving to support next-generation semiconductor processes with RPM™-based precision 3D metrology.

Infinitisima has embarked on a project to improve the performance of its Metron3D 300mm inline wafer metrology system together with major partners including ASML.

This project will focus on developing key metrology technologies for next-generation 3D logic semiconductor structures and will be conducted over the next three years.

The project will center around Infinitisima’s patented Rapid Probe Microscope (RPM™) technology, which is expected to deliver high-speed image acquisition, interferometric precision, and in-depth 3D surface analysis capabilities.

This is an inline solution that can quickly and accurately obtain precision measurement data required for future processes such as hybrid bonding, high-NA EUV lithography, and CFET (complementary field-effect transistor).

Infinitisima will install the system at imec, a global hub for nanoelectronics and semiconductor technology, and begin research on high-NA EUV resist characterization and advancement together with ASML and others.

This is expected to accelerate the development of next-generation devices and provide verification for optimizing equipment performance.

InfinitySince 2021, SIMA and imec have been working together on nano-tomography and failure analysis projects using RPM™ technology.

This collaboration extends metrology applications to inline mass production environments, meeting the semiconductor industry’s growing demand for inspection of increasingly precise and complex structures.

“We are excited to expand our collaboration with iMec to support metrology challenges at key stages of semiconductor manufacturing,” said Peter Jenkins, President and CEO of Infinitisima. “This project marks a significant milestone in the path to true 3D process control for the semiconductor industry.”