This interview explores how industry leaders are responding to the rapidly increasing power demand in data centers due to the rapid development of artificial intelligence (AI), which is putting a strain on the power grid.

According to President Adam White, Infineon prioritizes power efficiency from the early stages of AI system design.

In modern AI servers where watt-per-compute is emphasized, power efficiency is as important a competitive factor as performance. To this end, Infineon announced that it is reducing the total cost of ownership (TCO) by minimizing the loss of power semiconductors and increasing the lifespan and reliability of components.

President Adam White said the company is committed to its “Power first” and “Grid to Core” principles, which ensure efficient and reliable energy flow.He said that he was focusing on the chick.

'Grid to Core' is an approach that consistently optimizes the entire power supply chain from the power grid to AI cores such as GPUs and TPUs.

220V AC power is converted into 48V→12V→1V DC in multiple stages inside the data center.

Infineon has reduced energy loss by half with SiC (silicon carbide) and GaN (gallium nitride)-based wide band gap (WBG) semiconductors and advanced packaging technology that increase conversion efficiency at each stage to up to 98%.

The amount of computation required to train modern AI models has doubled roughly every 3.4 months since 2012.

This is expected to increase data center power consumption from the current 2% of global power consumption to 7% by 2030.

In major data hubs across the U.S., data centers are expected to use up to 16% of total electricity by 2030, and in Ireland, up to 32%.

To increase energy efficiency in AI data centers, Infineon is focusing on key areas such as advanced semiconductor materials, optimized power architecture, advanced packaging technology, and smart control and monitoring.


State-of-the-art WBG materials are SiC and GaN power switches that minimize losses even in high-temperature and high-voltage environments.

Advanced packaging maximizes the thermal performance and efficiency of power modules with chip embedding and integrated magnetics.

The smart control system optimizes PUE (Power Usage Effectiveness) through workload-based dynamic power adjustment.

The power and cooling requirements for each AI server are up to 30 times higher than those of conventional servers, sharply increasing TCO.

Infineon’s high-efficiency, high-reliability power components significantly reduce power loss and downtime risk, reducing the operating costs of AI data centers and preventing millions of dollars in losses due to unplanned downtime.

Key innovations include the TDM2254xD power module, which supports high-density power conversion up to 160 A by integrating OptiMOS™ MOSFETs.


The 12kW high-efficiency PSU maintains efficiency of over 97.5%, significantly reducing server rack power loss.

“As AI becomes more deeply ingrained in our lives, power supply solutions must also continuously evolve,” said President Adam White. “Infineon is working with global customers and ecosystem partners to pursue both efficiency and sustainability, and is accelerating the development of cutting-edge power semiconductor technologies that will lead the digital transformation and decarbonization era.”

He also said, “Innovation in energy efficiency of AI data centers around the world is key to securing environmental sustainability and economic feasibility,” and “Infineon’s ‘Power First·Grid to Core’ strategy is evaluated as the solution to this challenge.”

Meanwhile, President Adam Whiteign=202507_ap_kr_pss.a.dc&utm_medium=3rdptmedia&utm_source=e4ds_bannerads&utm_content=_&utm_term=banner&uid=ci41650001&aid=ai4165" target="_blank">The full interview can be downloaded from the Infineon website .