ROHM has begun mass production of its TOLL package SiC MOSFET product line, the "SCT40xxDLL" series, which simultaneously achieves miniaturization and high power response, in September 2025.


Compared to the existing TO-263-7L package, heat dissipation has been improved by approximately 39%, the component area has been reduced by approximately 26%, and the thickness has been reduced to 2.3 mm, which is half the thickness, satisfying both high power density and space saving.

The new product has a drain-source rated voltage of 750 V, which is higher than the 650 V of general TOLL package products, enhancing surge voltage resistance and contributing to reducing switching loss by suppressing gate resistance.

A total of six models will be released, ranging from 13 mΩ to 65 mΩ based on ON resistance, and the sample price is 5,500 yen (excluding tax) per unit.

This product is suitable for industrial devices that require both high power and thinness, such as AI servers, data centers, power storage systems (ESS), and small PV inverters. It is specifically designed to support 'pizza box type' totem-pole PFC circuits with a thickness of 4 mm or less, and performs well in environments requiring high-efficiency power factor improvement and high-temperature operation.

ROHM applied its EcoSiC™ brand to this product. EcoSiC™ is a silicon carbide (SiC)-based power device brand that delivers performance superior to silicon (Si). The company boasts a comprehensive production system utilizing proprietary technologies, from wafer manufacturing to packaging and quality control.

The new products are available for purchase from online component distribution sites such as CoreStaff Online and Chip 1 Stop, and simulation models for six models are also available on ROHM's official website to quickly support circuit design reviews.

ROHM stated, “This SiC MOSFET product satisfies the conflicting demands of high power and miniaturization, and will contribute to increasing design freedom and energy efficiency in industrial equipment.”