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▲TI announced a new power management solution for AI data centers at OCP, meeting their power demands. (Photo: TI)
Support for 800VDC architecture in collaboration with NVIDIA
30kW power supply unit for high-load AI unveiled
Texas Instruments (TI) meets the power demands of AI data centers with next-generation, scalable power management solutions.
TI Korea (CEO Park Joong-seo) announced on the 14th that it had recently announced a new power management solution for AI data centers at the Open Compute Summit (OCP) held in San Jose, USA.
This announcement focuses on implementing a scalable power architecture from 12V to 48V to 800VDC to meet the growing demands of AI computation.
TI, in collaboration with NVIDIA, presented an 800VDC-based power architecture in a white paper titled “Power Supply Tradeoffs for the Growth of Advanced AI Computing.”
With IT rack power expected to exceed 1MW within the next 2-3 years, this paper addresses system-level design challenges for high-efficiency, high-power-density energy conversion.
TI also unveiled a 30kW power supply unit design for high-load AI workloads.
The design consists of a three-phase, three-level flying capacitor PFC converter and a dual delta-delta three-phase LLC converter, with a single 800 V output or separate outputs. Supports all configurations.
Looking at the lineup of ultra-small, high-performance power devices, the CSD965203B integrates a two-phase smart power stage in a 5 mm × 5 mm QFN package, providing up to 100 A peak current per phase.
The CSDM65295 delivers high efficiency and thermal performance with up to 180 A peak current and TLVR option in a 9 mm × 10 mm × 5 mm package.
The LMM104RM0 is a GaN-based intermediate bus converter that delivers up to 1.6 kW of output power and over 97.5% conversion efficiency in a quarter-brick form factor.
TI provides solutions that cover the entire power flow, from power generation in power plants to GPU logic gates, and works with data center designers to help them build safe and efficient power infrastructure.
TI will be showcasing its latest technologies at OCP booth C17, and on October 15th, systems engineer Desheng Guo will present “Advanced Data Center AC/DC Distribution and Conversion Power Architecture,” and technology manager Pradeep Shenoy will lead a poster session on “Series Stack Power Delivery Architecture.”