The Next Generation Intelligent Semiconductor Project Group (Director Kim Hyung-joon) and Seoul National University of Science and Technology discussed the latest technological trends in the field of optical packaging, the training of specialized personnel to respond to industrial demand, and the potential and challenges of glass substrates as next-generation packaging materials, presenting insights for the development of Korea's optical packaging technology.

The Next Generation Intelligent Semiconductor Project Group (Director Kim Hyung-joon) and Seoul National University of Science and Technology held the '2025 2nd Advanced Optical Packaging Technology Seminar' at Eui Hall of Seoul National University of Science and Technology on the 17th.

This seminar was held to lay the foundation for the entry of personnel into the optical packaging industry by exploring career paths to secure specialized personnel capable of meeting industrial demands and by sharing the latest technology trends in the field.

In his opening remarks, Director Kim Hyung-joon stated, “Large-scale semiconductor projects supported by the government with 1.0096 trillion won over the past 10 years have served as the foundation for the development of the domestic industry,” adding, “Under the management of the Next Generation Intelligent Semiconductor Project Group, major companies such as Rebellion have grown into unicorn companies worth 1 to 2 trillion won, proving the success of the national project.”

On the other hand, in the global foundry market, TSMC is dominating with a 70% market share, and the gap is widening, and the cause... It was pointed out that one of the issues is a lack of packaging technology.

Director Kim Hyung-joon emphasized, “Packaging has moved beyond its past role of simple chip protection and has established itself as a bottleneck and core technology of the semiconductor industry,” adding that “unless packaging issues are resolved, the sustainable development of the Korean semiconductor industry will be difficult, making it urgent to show interest in the field and cultivate talent.”

Next, Professor Kim Seong-dong of Seoul National University of Science and Technology gave a presentation on 'Trends in Advanced Packaging Technology'.


Professor Kim Seong-dong stated that packaging technology plays a key role in overcoming the limitations of existing microfabrication processes and the economic feasibility issues of wafer scaling.

Next, various new technologies were introduced, such as 2.5D and 3D packaging, silicon interposers, and glass interposers, which reduce data transfer distances between chips and realize high-speed and low-power processing.

Professor Kim Seong-dong stated, “In response to the rapid growth of AI and data centers, optical packaging technology is gaining attention for its ability to improve energy efficiency and data transmission speeds,” adding, “Advanced packaging is the key to semiconductor performance innovation, and related research and investment must be further expanded.”

Following this, Choi Kwang-sung, Head of Division at the Korea Electronics and Telecommunications Research Institute, gave a presentation on the topic of “The Past, Present, and Future Outlook of CPO (Co-Packaged Optics) Technology.”
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Choi Kwang-sung, Head of Division at the Korea Electronics and Telecommunications Research Institute, is giving a presentation on the topic of 'Past, Present, and Future Outlook of CPO (Co-Packaged Optics) Technology'.