It has been revealed that STMicroelectronics (hereinafter ST), a global semiconductor company, played a decisive role in the expansion of Starlink's global internet service through the joint development of custom semiconductor chips for SpaceX's Starlink over the past decade.

ST announced on the 18th that the number of global Starlink users has surpassed 8 million, celebrating a 10-year partnership with SpaceX for the joint development of custom chips for satellite communication.

This announcement officially acknowledges the achievements of the technological cooperation that the two companies have built over the past decade, while also signaling an expansion of cooperation toward the development of next-generation satellites and user terminals.

Starlink is a broadband internet service for homes and businesses that utilizes low Earth orbit (LEO) satellites, providing high-speed internet in more than 150 countries worldwide.

In particular, ST's BiCMOS-based high-performance phased array antenna technology is a core component of Starlink user terminals, enabling high-speed, low-latency internet by reliably connecting to thousands of LEO satellites.

This device is considered the first 'consumer-grade phased array antenna' and significantly enhances user convenience by allowing installation in just two steps: plugging it in and positioning it upwards.

Over the past 10 years, both companies Co-designed billions of custom chips and applied them to millions of user terminals, and also contributed to the production of more than 10,000 Starlink satellites.

In particular, the latest V3 satellite provides a fronthaul throughput of over 1 Tbps and has established itself as a key infrastructure to meet the growing demand for global connectivity.

SpaceX currently produces and ships more than 20,000 Starlink terminals per day, and ST has played a key role as a supply chain partner supporting this mass production system.

ST products are jointly designed by French and Italian engineers, manufactured at a French fab, and packaged and tested in Malaysia and Malta.

In particular, ST developed a new PLP (Panel Level Packaging)-based manufacturing process for Starlink to meet stringent quality standards and mass production requirements.

Currently, ST supplies over 5 million chips per day, supporting Starlink's rapid growth.

SpaceX President and COO Gwynne Shotwell said, “Our collaboration with ST has played a key role in realizing Starlink’s scale and performance,” adding, “We are pleased that through our partnership, we can secure stable internet access in more regions and expand opportunities in education, healthcare, and business.”

Remi El-Ouazzane, President of ST’s Microcontroller, Digital IC, and RF Products Group, stated, “The close collaboration with SpaceX from the initial concept stage to mass production is a testament to ST’s technological prowess and manufacturing capabilities. ST is strengthening its expertise in space-grade applications by providing core technologies not only for Starlink user terminals but also for satellite payload systems.” He emphasized, "There is."