EV Group (EVG) has unveiled the next-generation EVG®120 automated resist process system applicable to mass production environments. The new equipment features improved throughput and process control performance based on a compact platform, while inheriting design elements from the existing EVG®150 system.

On February 19, EVG announced the introduction of the EVG®120 as a major update to its coater and developer platform. The company explained that through a new architecture and scalability, it has increased throughput by 40% and reduced the footprint by more than 20% compared to the previous generation.

Enhanced expansion capabilities and modular structure

The EVG®120 has been redesigned as a 200mm platform integrating up to two wet process modules and 14 bake-chill plates. This improves maintenance accessibility and flexibly supports a modular configuration. It can process various substrates from 2 inches to 200 mm and supports a wide range of materials, including thin film and thick film resists, PI and PBO insulating materials, and black, color, and IR resists.

New features include Wafer Edge Exposure (WEE) and in-situ resist thickness measurement. In-situ measurement supports real-time thickness monitoring in the range of 50 nm to 50 µm, enabling its use in process control and yield management. Additionally, a closed-loop feedback-based high-viscosity dispensing system enhances the precision of thick-film photoresist coating, and support for SMIF load ports and standby modes addresses requirements for cleanliness management and energy savings.

This equipment also incorporates the CoverSpin™ ball design and OmniSpray® conformal spray coating technology that EVG has applied to its existing platforms. The company explained that these technologies contribute to ensuring uniformity, reducing material usage, and supporting substrates with stepped structures.

Dr. Thomas Glinsner, Corporate Technology Director at EVG, stated that the design was created to reflect various customer needs from research and development to mass production. He added that the focus was on securing both throughput and flexibility on a compact platform while inheriting the capabilities of the EVG®150.

The EVG®120 targets growth sectors such as advanced packaging, MEMS, image sensors, photonics, power semiconductors, and wafer probe cards. The market response is being closely watched, coinciding with the industry's growing demand for mass production equipment based on small footprints and modular scalability.