Recently, the semiconductor industry and the electronic system design environment have been changing rapidly.

As generative AI, high-performance computing (HPC), data centers, network equipment, and FPGA and ASIC-based systems expand, the current capacity required in power design is continuously increasing.

In particular, because the latest processors and accelerator chips require currents ranging from hundreds of amperes at very low voltages, power supplies must simultaneously meet higher current density and faster response characteristics.

However, providing high efficiency and high output current simultaneously within a limited PCB area remains the most difficult challenge in power supply design.

In this environment, an approach that has recently been gaining attention is high-density power module-based design.

Power modules that integrate controllers, MOSFETs, inductors, and key passive components into a single package can reduce design complexity and increase power density while significantly shortening development time.

The MPM3695 family of power modules, developed to meet these demands, is designed as an integrated power solution for high-current applications.

This module allows monitoring and setting key system parameters via the PMBus interface, and enables the realization of very high output current by connecting multiple modules in parallel.

Design flexibility is significantly enhanced thanks to a structure that starts with a single module and can be expanded according to system requirements.br />
The MPM3695 family uses a multiphase structure-based control method to provide very fast transient response characteristics.

This is particularly important for FPGA, GPU, and AI accelerator power rails with rapidly changing load conditions.

Thanks to these characteristics, a stable power supply can be maintained even in large-scale data processing systems or high-performance computing platforms.

In addition, by using a multiphase interleaving structure within the module to distribute current, efficiency and thermal performance can be improved simultaneously.


Table 1 shows the main product composition of the MPM3695 family.

Each product differs in output current per phase, package size, and scalable total output current, allowing designers to select the product that best suits system requirements.

Some products can provide currents of up to several hundred amperes, and connecting multiple modules in parallel can supply up to 800A of current.

In addition, this power module allows for easy setting of output voltage margin, error threshold, and Power Good (PG) threshold through a PMBus-based digital interface.

This feature allows relevant parameters to be automatically adjusted even when system voltage changes, reducing manual settings during the design process and accelerating development speed.

■ Output voltage setting method

The MPM3695 family provides two methods for setting the output voltage.

One method uses an internal resistance divider, and the other uses an external resistance divider.

Each method has different advantages depending on the design purpose, so it can be selected to suit system requirements.

First, the method using an internal resistor divider is a way to set the output voltage by utilizing a voltage divider network already configured inside the power module.

This method has the advantage of reducing the number of external components and simplifying the circuit configuration.

It is particularly useful for systems with limited PCB space or projects where design time needs to be reduced.


Figure 1 shows a typical application circuit of a single module configuration using an internal resistor divider.

With this method, the power circuit can be configured with only a minimal number of external components, allowing the overall design to be simplified.

On the other hand, the method using an external resistor divider provides the flexibility to adjust the output voltage more finely.

This method is advantageous for custom designs requiring specific voltage rails or for systems where thermal management and layout optimization are critical.

In addition, the voltage adjustment range can be set widely, allowing it to meet various processor power requirements.


Figure 2 shows a typical application circuit using an external resistor divider.

This configuration requires additional external components compared to the internal voltage divider method, but it has the advantage of allowing for more precise setting of the output voltage.

■ Extended structure for high-current applications

Modern systems, such as AI servers, data center accelerators, and high-performance network equipment, often require hundreds of amperes of current from a single power rail.

To meet these requirements, the MPM3695 family supports a modular parallel connection structure.

If multiple modules are connected in parallel, each module shares the current.The total output current can be expanded.

In addition, it is designed to balance currents between phases through an automatic interleaving structure, allowing for simultaneous improvement in current distribution and efficiency.

This method provides the effect of increasing power density in high-current systems while simultaneously improving heat dissipation.

In particular, the response speed of the power circuit is important in power supplies for high-performance FPGAs, ASICs, and GPUs because load fluctuations occur very rapidly.

Power modules based on a multiphase structure can maintain a stable voltage by providing very fast transient response characteristics in such environments.

■ Design advantages provided by the integrated power module

Recent trends in power design are shifting beyond mere high efficiency to simultaneously consider power density, design simplicity, and development speed.

In this context, integrated power modules offer several advantages over conventional discrete power designs.

First, design complexity is significantly reduced because key power components and control circuits are integrated into a single package.

Second, the optimized internal layout shortens the power path, improving efficiency and thermal characteristics.

Third, thanks to the proven module-based design, the system development period can be shortened.

These characteristics provide even greater value, particularly in applications requiring high current and high power density, such as AI computing, data centers, telecommunications infrastructure, and industrial computing equipment.

■ Conclusion

As the performance of electronic systems continues to improve, power supply designs are also being required to have higher currents and higher power densities.

Integrated power in this environment Modular-based design is establishing itself as an important alternative in terms of power efficiency, system stability, and design simplicity.

High-current power modules such as the MPM3695 family can meet various system requirements through flexible output voltage setting methods and scalable current structures.

In addition, PMBus-based digital control functions simplify system monitoring and configuration, providing an effective solution for the power design of next-generation high-performance electronic systems.

※ Contributor

Taehoon Jeong, Director of Technical Support, is responsible for technical support at MPS (Monolithic Power Systems) and focuses on supporting industrial and consumer products. He is an engineer with over 16 years of experience in precision control and sensing, as well as power conversion and management, required for industrial applications. In particular, he strives to solve the requirements and challenges of clients together through modular products.