SK Hynix unveils its next-generation memory competitiveness on a stage leading global artificial intelligence (AI) technology trends.

SK Hynix announced that it will participate in 'NVIDIA GTC 2026,' held in San Jose, California, from the 16th to the 19th, and showcase core AI infrastructure technologies.

NVIDIA GTC is a leading global conference where major companies and developers in the fields of AI and accelerated computing from around the world gather to share the latest technologies and industry visions.

At this event, SK Hynix plans to focus on introducing memory solutions that maximize AI learning and inference performance, centering on the results of its collaboration with NVIDIA.

The exhibition theme is 'Spotlight on AI Memory,' and it is designed to allow visitors to view the full lineup of memory products targeting the AI era at a glance.

The exhibition space is divided into the NVIDIA Collaboration Zone, Product Portfolio Zone, and Experiential Event Zone to enhance visitors' understanding.

The NVIDIA Collaboration Zone at the entrance showcases examples, both in physical form and through models, where SK Hynix's high-performance memory products, such as HBM4, HBM3E, and SOCAMM2, are applied to the NVIDIA AI platform.

Memory embedded in GPU-based AI acceleratorsIt is characterized by a design that allows the structure to be checked intuitively.

In addition, NVIDIA's AI supercomputer 'DGX Spark,' equipped with eSSDs and LPDDR5X featuring liquid cooling technology, will also be on display.

In the Product Portfolio Zone, a diverse range of products spanning from AI data centers to on-device applications is introduced, including HBM, high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and automotive memory solutions.

Visitors can select products of interest through an interactive interface and directly check technical characteristics and use cases.

In the event zone, an experience program utilizing the HBM stacking structure is being operated.

It is designed to help users understand TSV processes and high-stacking packaging technology through a game of stacking virtual memory chips.

During the event, key executives including SK Group Chairman Chey Tae-won and SK Hynix CEO Kwak No-jung are scheduled to meet with global big tech companies to discuss cooperation plans regarding the development of AI technology and changes in infrastructure.

Through technical sessions, the role of memory technology in AI-based manufacturing innovation and the implementation of high-performance AI will also be shared.

"As AI becomes more advanced, memory is establishing itself as a key factor determining system performance," an SK Hynix official said. "Based on our technological capabilities encompassing the entire spectrum of AI, from data centers to edge devices, we will contribute to the expansion of the AI ecosystem with our global partners."