STMicroelectronics (hereinafter ST) has enabled high-resolution sensing even in small systems with limited computing resources through its 'VL53L9', an all-in-one dToF (Direct Time-of-Flight) 3D LiDAR module aimed at spatial perception in small microcontroller (MCU)-based edge AI systems.

ST announced on the 23rd that it has launched the VL53L9. This module provides a field of view of 54°×42°, 2,268 (54×42) zone resolution, on-chip processing, 100 frames per second, and a sensing range of 5cm to 9m.

The company explained that by integrating functions into a cost-effective, compact package, it can be applied to robotics, industrial automation, smart buildings, AR/VR, healthcare, and more.

VL53L9 measures distances from less than 5 cm to up to 9 m with up to 1% accuracy based on stacked BSI SPAD sensor technology and metasurface optical elements (MOE).

Dual-Scan Flood Illumination replaces the existing dot scanning method with motion artifacts and dead zones Reduces and simultaneously acquires 2D infrared images and 3D depth images.

ST stated that this simplifies the post-processing process, enabling the implementation of various edge AI use cases even on small MCUs.

Alexandre Balmefrezol, Senior Vice President at ST, said, “By implementing high-resolution depth data and an integrated architecture into a single compact module, we simplified the integration process and reduced system complexity.”

The VL53L9 integrates on-chip dToF processing capabilities and a dedicated power management IC, and is said to be able to reduce system costs and complexity by eliminating the need for a separate calibration process.

It is a single-component module that supports the reflow process with dimensions of 12.8mm × 6.1mm × 4.6mm.

It supports dual power supply (1.2V and 3.3V) operation and MIPI or I3C interfaces, and has obtained Class 1 laser safety certification.

Mass production is planned for early July 2026, and samples and large-scale supply to customers worldwide are scheduled to take place.