SK Hynix has won the IEEE Corporate Innovation Award for the first time in recognition of its contribution to the expansion of the AI computing ecosystem based on High Bandwidth Memory (HBM) technology.

SK Hynix announced on the 26th that it received the Corporate Innovation Award at the '2026 IEEE Awards' ceremony held in New York, USA on the 24th (local time). The IEEE is an international organization of technical experts in the fields of electrical, electronic, and computer engineering, which annually selects and awards individuals and organizations that have contributed to technological innovation and industrial development.

The Corporate Innovation Award is part of the IEEE Achievement Awards and is presented to companies that have contributed to industrial and social development through innovative technology. It was established in 1986, and this is the first time SK Hynix has received the award.

This award is based on the recognition that the achievements in HBM technology development and mass production have contributed to the spread of AI computing. HBM is a high-performance memory that increases data processing speed and power efficiency by stacking multiple DRAMs vertically, and is utilized in AI accelerators and data centers that require large-scale computation.

SK Hynix has been meeting the demand for AI infrastructure construction from global customers by stably mass-producing all generations of HBM products. In particular, as memory bandwidth and supply stability have become critical as the scale of AI models grows, HBM is establishing itself as a core component supporting the performance of AI semiconductors, such as Graphics Processing Units (GPUs).

Ahn Hyun, President and Head of Development at SK Hynix, attended the awards ceremony as the company's representative. Referring to the employees' efforts in technology development, President Ahn expressed his intention to provide memory solutions required by the AI market through collaboration with global customers and partners.