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Lee Seok-hee, Intel Senior Vice President
General Manager of Advanced Packaging, System Integration, and Backend Manufacturing
Intel has set out to strengthen its advanced packaging and system integration capabilities by recruiting Lee Seok-hee, former CEO of SK Hynix, as Senior Vice President of Intel Foundry.
This is a move to secure manufacturing capabilities that extend beyond the chip level to the system level.
Intel announced the appointment of Senior Vice President Lee Seok-hee on the 19th.
This senior vice president reports directly to Intel CEO Lip-Bu Tan and oversees advanced packaging, system integration, backend technology development, and backend manufacturing.
Intel announced that it is assigning a role to strengthen relevant capabilities to provide system-level technology to customers.
Intel has designated advanced packaging as a core business area and formed a dedicated management team.
This is based on the assessment that packaging is becoming an increasingly important factor determining the overall performance, power efficiency, and heterogeneous integration of AI systems.
CEO Rip-Bhutan stated, “Advanced packaging and system integration are becoming core competencies defining next-generation computing systems,” adding, “Senior Vice President Lee possesses expertise in leading large-scale technology and manufacturing organizations, as well as a track record in operational execution.” said.
He added that it would be the right person to lead Intel in expanding advanced packaging technologies, including EMIB-T and HBI, to mass production.
Senior Vice President Lee Seok-hee joined Intel after serving as CEO and President of SK Hynix and CEO and President of SK On.
He is known to have previously served as an engineering leader at Intel and academia, and possesses expertise in advanced process technology and large-scale manufacturing.
“The demand for system-level integration across AI and high-performance computing is accelerating,” said the Senior Vice President. “I will contribute to enhancing Intel’s technology leadership and manufacturing capabilities, and strengthening customer support.”
Naga Chandrasekaran, Executive Vice President of Intel Foundry, reports to CEO Rip-Bhutan as before and leads front-end technology development and manufacturing.
Focus on accelerating mass production of Intel 18A, Intel 14A, and next-generation technologies, and continue to oversee design support, customer touchpoints, and business support.
Along with this announcement, Intel stated that Senior Vice President Navid Shahriari is scheduled to retire after 37 years of service.