Nearfield Instruments, a Dutch semiconductor 3D metrology and process control company, has raised $380 million in Series D funding.
In this round, the company was valued at $1.6 billion, and the company stated that this is the largest investment ever raised in the Dutch deep tech sector.

Nearfield announced on the 23rd that it had closed the Series D round.

Fidelity Management & Research Company, a new investor, led the round, and the Qatar Investment Authority (QIA), Qatar's sovereign wealth fund, also participated for the first time.

Existing investors Temasek, Walden Catalyst Ventures, Innovation Industries, M&G, Invest-NL, TNO Ventures, and ING have also joined, and this round is reported to have been oversubscribed.

The secured investment will be used to accelerate the product roadmap, establish Applications Centers of Excellence worldwide, expand production capacity, strengthen global customer support organizations, and expand joint research and development (R&D) with semiconductor manufacturers.

Nearfield explained that it provides measurement technology required for High-NA Extreme Ultraviolet (High-NA EUV), Gate All Around (GAA), Complementary Field Effect Transistor (CFET), and Hybrid Bonding-based 3D Integration.

The proprietary platform QUADRA supports non-destructive, high-throughput atomic force microscope (AFM)-based 3D measurements.

Nearfield was established in 2016 as a spin-off from the Royal Netherlands Institute of Applied Sciences (TNO), and its headquarters are in Rotterdam.

It operates businesses in Korea, Taiwan, Japan, Singapore, the United States, and Belgium, and has approximately 450 employees.

Domestically, we have a subsidiary in Hwaseong and are collaborating with client companies.

Co-founder and CEO Hamed Sadeghian stated, “The conclusion of this round demonstrates the growing strategic importance of metrology and inspection technologies in the era of AI-driven semiconductor innovation.”

Young-Kwon Son, founding managing partner of Walden Catalyst Ventures (and former CSO of Samsung Electronics), who led this investment, said that advanced metrology technology will be a key element of next-generation chip innovation at the intersection of AI expansion and the transition to 3D semiconductor architecture.