Against the backdrop of expanded investment in AI infrastructure and increasing demand for advanced memory, global investment in 300mm memory fab equipment is projected to surpass $50 billion for the first time this year.
Both DRAM and NAND recorded double-digit growth, and the growth trend is expected to continue in the mid-to-long term.

SEMI predicted in its latest 300mm fab outlook report on the 30th that global investment in 300mm fab equipment for the memory sector this year will reach $52 billion, a 29% increase from the previous year.

In 2027, it is expected to increase by an additional 11% to $57 billion.

The average annual growth rate from 2024 to 2029 is 19%, and the investment amount is projected to approach approximately $80 billion in 2029.

Ajit Manocha, CEO of SEMI, stated, “Strong demand for HBM and other advanced memory technologies is reshaping investment priorities across the semiconductor supply chain,” adding that “memory manufacturers are accelerating investments in expanding production capacity and technology transitions to support next-generation data-intensive applications.”

DRAM equipment investment is projected to reach $37 billion this year, up 29%, driven by demand for HBM and DDR5 for GPUs and AI accelerators.

3D NAND equipment investment and AIIt is expected to reach $14 billion, up 28%, due to increased demand for data storage resulting from the expansion of the market.

Global 300mm memory production capacity is predicted to expand to 4.1 million units per month in 2026 and 4.2 million units per month in 2027.

This report includes 413 fabs and production lines worldwide, and reflects 155 updates and 7 new fab and line projects compared to the previous report published last March.