AMD has unveiled a next-generation adaptive SoC that integrates memory directly into the chip package. It features a design aimed at simultaneously addressing system size and power efficiency issues.

AMD announced its second-generation 'Versal Premium MoP (Memory on Package)' adaptive System-on-Chip (SoC) on the 30th. The product features a structure that integrates memory inside the package.

The Versal Premium Gen 2 MoP contains up to 32GB of LPDDR5X memory in a single package and provides a data transfer bandwidth of up to 307GB/s.

It is a structure that increases data transfer speed and reduces latency and power consumption by placing memory inside the package rather than externally. At the same time, the system board area can be reduced by up to approximately 60%.

This technology also helps shorten development time by reducing the memory design and verification processes that were previously required at the board stage.

In addition, it is characterized by minimizing memory interface wiring work and reducing design complexity through an integrated design within the package.

This product was designed for industrial and mission-critical environments. It is supported to operate in a range from minus 40 degrees to plus 110 degrees.

In addition, it is designed to ensure stability in long-term operating systems by aiming for a product life cycle of more than 15 years.

This reflects the demands of the industrial and defense sectors, which require long-term operation, unlike High Bandwidth Memory (HBM), which is being rapidly replaced by data centers.

AMD stated that this product can be utilized in various high-performance applications, including networking, aerospace and defense, data processing, and image processing.

In particular, it presented environments requiring high-performance computing and large-scale data processing, even in systems with space and power constraints, as its primary target.

The product is planned to enter the mass production phase after supplying samples at the end of 2026.