The Next Generation Intelligent Semiconductor Business Group announced the official launch of new research projects aimed at securing core technologies for next-generation AI semiconductors. The development of next-generation semiconductor technologies, such as in-memory computing (IMC), next-generation memory, brain-mimicking semiconductors, and 3D integration technology, has been selected as a major research target.

The Ministry of Science and ICT, the National Research Foundation of Korea, and the Next Generation Intelligent Semiconductor Project Group held the '2026 Next Generation Intelligent Semiconductor Technology Development Project (Device) New Project Launch Exchange Meeting' at the El Tower in Yangjae, Seoul on the 1st.

Officials from the project team, government and specialized agencies, principal investigators of newly selected projects, and participating researchers attended the event to share research goals and implementation plans.

A total of six new projects were announced at this exchange meeting.

Major research projects introduced include: development of an ultra-low power, ultra-high efficiency in-memory computing integrated chip based on ferroelectric devices (POSTECH); development of SOT-MRAM array technology for AI computation (Yonsei University); development of 3D SRAM process and integration technology (Seoul National University); development of cerebellar-mimicking semiconductor technology for physical AI (KIST); development of a monoolithic 3D-based AI accelerator (Kyung Hee University); and development of an AI synapse device based on DRAM-flash hybrid memory (Ewha Womans University).

The Next Generation Intelligent Semiconductor Business Group conducted consulting to review the research direction of new projects and explore possibilities for research collaboration between projects.

The project team presented the review of research methodologies for achieving project goals and the sharing of strategies for generating results as the main objectives of this exchange meeting.

At the event, Lee Seok-hee, team leader of the Next-Generation Intelligent Semiconductor Business Group, explained that the group has focused on supporting the development of source technologies for new devices and wafer-level verification in the first phase of the project, and is currently expanding integration research that can be linked to actual semiconductor processes.

In addition, they stated that they are pursuing the planning of new projects to ensure that outstanding results lead to follow-up research, and are also strengthening public promotion of research achievements.

This teamJang said that he is actively promoting the excellent achievements created by researchers through official channels, such as press releases from the Ministry of Science and ICT, and that he will support efforts to make it easier for the results of research to be conveyed to the public.

The project team plans to continue supporting the source and integration technologies necessary for realizing next-generation AI semiconductors, aiming to secure domestic semiconductor research competitiveness.