이*보 : I'm wondering about the measurement method to determine which phenomenon is the cause and which is the effect when power supply variation and clock jitter occur simultaneously in a processor.

박*지 : When the power supply rail rise curve does not increase monotonically and exhibits slight bends or fluctuations in the middle, what problems should be suspected in an actual circuit?

김*민 : When a battery short circuit or overcurrent occurs, to what extent can the cutoff speed of the e-fuse and the actual battery protection level of the system be ensured?

박*차 : When applying an eFuse and high-side switch at the battery input stage, what advantages do they offer compared to conventional fuses or relays?

김*숙 : When the Switching Frequency increases due to SiC MOSFET application, how should the ESR, ESL, and high-frequency characteristics of the capacitor be considered?

최*태 : I am curious if there is a method to diagnose the deterioration state of capacitors in ESS during long-term operation through changes in capacitance or ESR.

박*현 : Fault diagnosis and PID tuning functions - are they just different system applications on the same board?

이*보 : I'm curious about the maximum output and maximum torque that can be supported for humanoid robot joints.

박*희 : 1. To maximize the hybrid architecture of this board, what tasks should be assigned to the MPU and MCU respectively? Additionally, when an error occurs in either the MPU or MCU processor, do you need to check logs separately for each, or is an integrated debugging environment provided? 2. When operating YOLO or facial recognition models, what is the maximum duration that allows continuous operation without thermal issues or performance degradation?

손*수 : What is the factor that has the greatest impact on measurement accuracy during PCB wiring design?

최*기 : What are the most common current sensing design problems that actual customers encounter, and how does Novosense solve them? What support materials are available that developers can immediately use, such as evaluation boards, design examples, and simulation models?

권*식 : Thank you for the helpful lecture. We are also using Infineon solutions well. Recently, with the application of AI and digital twin, we need power/energy reduction solutions. Would it be possible to apply Infineon Industrial Drives to specific fields first? Since our development and design teams have been under heavy workload recently, I am curious whether we can pilot this in that area first, assess the effects, and then expand horizontally to other departments.

오*정 : [Question] IGBT4 products faced challenges in equipment miniaturization due to larger heat sinks and cooling fans. Are there any cases where actual system size has been reduced through IGBT7 application?

최*빈 : I am interested in understanding the extent to which changes in dielectric constant affect link performance when there is a plastic cover or protective glass between antennas, and what the design criteria should be.

최*태 : The 60GHz band has strong directional characteristics and sensitivity to obstacles. I'm curious about what technologies are being applied to maintain stable links even in environments where positions continuously change, such as with industrial robots or rotating equipment, and what solutions are being implemented.

이*규 : When conducting in-system testing after actually mounting chips on a board, the signal loading effect caused by probing itself often results in different signals before and after the measurement equipment. What de-embedding techniques or calibration functions does the Introspect solution provide to overcome the limitations of such probing environments?

손*수 : How does Introspect Analyzer secure its accuracy advantage compared to oscilloscope-based measurement in MIPI D-PHY 4.5Gbps or higher, or C-PHY v2.1 environments?

조*휘 : When there is no change in noise level even after changing the noise filter, what is the reason for this? (Is it because there is no change due to the antenna function of the internal metal?)

정*나 : When maintaining consistent trace width during PCB design, what design rule should be prioritized first in practice to minimize impedance discontinuity that occurs during layer changes (Vias)?

박*식 : Is it acceptable to have components such as an MCU placed on the back side of the sensor pad?