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Overcoming semiconductor limitations is now packaging

Google 우선 소스 기사입력2023.06.07 09:43


2023 e4ds Semiconductor Packaging Day Held
Transfer of the latest data from the best experts at home and abroad

As semiconductor miniaturization reaches its limits, packaging technology is emerging as a way to overcome technological limitations. In the midst of this, a forum for top domestic and international experts to present the latest semiconductor packaging technology is attracting attention.

Channel 5 Korea and e4ds news will jointly host the ' 2023 e4ds Semiconductor Packaging Day ' at the Korea Conference Center Main Hall on Wednesday, June 28.

This seminar will be held under the theme of ‘Next-generation packaging technology trends to overcome semiconductor limitations’, and will be attended by leading domestic and international semiconductor packaging experts who will present the latest technologies and suggest the direction in which our country’s semiconductor packaging industry should move forward.


The presentations were as follows: △Hyundai Motor Securities Research Center Director Noh Geun-chang on 'Next-generation Advanced Packaging Industry', △Nepace Vice President Kim Jong-heon on 'Global semiconductor industry & Advanced packaging technology trend', △Intel Director Park Sung-soon on 'Advanced Packaging Technology Trends', △Applied Materials Favier Shoo on 'Enabling Heterogenous Integration with Advanced Packaging Technology', △Hanyang University Professor Yoo Bong-young on 'Semiconductor packaging technology trends', and △Next-generation intelligent packaging.Team Leader Han Kyu-min of the Conductor Business Unit will present on domestic semiconductor packaging technology and fostering the packaging industry.

This seminar is expected to be an opportunity to examine the semiconductor packaging trends in which cutting-edge technology competition is taking place and to obtain the latest insights from the global semiconductor industry.

Registration can be done on the e4ds news conference ' 2023 e4ds Semiconductor Packaging Day ' ( https://www.e4ds.com/seminar_introduce.asp?idx=137 ) page.

As a related event, existing annual subscription members will receive a 50% discount on the registration fee, and those who register as e4ds members will be given a free one-month pass to the paid subscription service e4ds+.

For more information, please visit the e4ds news conference page.