No external leaks, no abnormalities in semiconductor production
Three people were injured when hydrofluoric acid leaked at SK Hynix's Icheon plant. There were reportedly no problems with semiconductor production.
On the 6th, a hydrofluoric acid exposure accident occurred on the 5th floor of the SK Hynix M16 semiconductor plant in Icheon-si, Gyeonggi-do.
One worker inspecting environmental analysis equipment suffered burns to his arms and legs in the accident, and two others were taken to the hospital with simple inhalation.
The injured were reported to be in good condition.
The exposed hydrofluoric acid was reported to be less than 500 ml and there was no external leakage.
According to reports, there are no abnormalities in the semiconductor production line.
Hydrofluoric acid (Hydrofluoric Acid) is used for cleaning semiconductors, plating tin, lead, solder, chrome, etc., corrosion of glass, sand removal from foundries, surface treatment of stainless steel, and pretreatment for plating.
It is a colorless, toxic, corrosive, non-flammable liquefied gas that produces white fumes with a very irritating acidic odor when in contact with moisture in the air. It is a substance that requires great care when handling because it is toxic, has very low surface tension, and has strong penetrative power.
Inhalation of fumes can cause lung inflammation or congestion, leading to organ damage, and direct skin contact can cause fatal burns.
In particular, secondary damage is a concern because hydrofluoric acid does not dissipate naturally. After a gas leak, the best way is to neutralize it by spraying an alkaline solution such as lime or sodium bicarbonate on the air, soil, or water.
In 2012, a hydrofluoric acid leak accident occurred at the Gumi National Industrial Complex, killing five people and seriously injuring eight others. This led to nationwide inspections of hydrofluoric acid handling facilities, and discussions on measures to support recovery from the leak accident in the Gumi area and prevent hydrofluoric acid leaks.