Embedded SIMs certified to the latest industry standards are expected to be used in IoT applications and equipment.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the introduction of the ST4SIM-201 embedded SIM (eSIM) for machine-to-machine (M2M) communications that meets the latest standards for 5G network access, machine-to-machine (M2M) security, and flexible remote provisioning and management.

Supporting ETSI/3GPP Release 16, ST4SIM-201 can connect to 5G SA (Standalone) networks. In addition, it can connect to LPWA (Low-Power Wide-Area) technologies such as LTE-M and NB-IoT (Narrowband Internet of Things), as well as 3G and 4G networks.

The ST4SIM-201 is certified according to the latest GSMA eUICC M2M specification, SGP.02 version 4.2, and can simplify provisioning and maintenance through remote issuance services. This device has obtained GSMA eUICC Security Authentication (eSA) using SGP.05 eUICC Protection Profile version 1.1.

Users can remotely change their preferred carrier without physically accessing the device. ST says this simplifies logistics, improves flexibility, and reduces the cost of ownership throughout the life cycle. Users can also use the test profiles and emergency profiles specified in SGP.02 version 4.2.

The ST4SIM-201, available in industrial grade, is suitable for IoT applications and all equipment requiring cellular connectivity. It emphasized that it can be used in various IoT devices including △smart meters △asset trackers △health monitoring devices △security devices △telemetry equipment △safety systems.

ST added that it is compliant with ETSI specifications to improve the efficiency of M2M applications, including Power-Saving Mode (PSM) and extended Discontinuous Reception (eDRX) to maximize idle mode usage. The ST4SIM-201 also supports ETSI-defined suspend/resume commands to improve power management efficiency.

ST4SIM-201 is said to be available in various forms to meet different customer requirements, including △5mm x 6mm DFN8 (Dual Flat No-Lead 8) package △WLCSP (Wafer-Level Chip-Scale Package) △USIM card standard 2FF·3FF·4FF plug-in card.