Furiosa AI's domestic AI semiconductor Warboy has proven its commercial competitiveness.

AI semiconductor specialist Furiosa AI announced on the 16th that it had achieved good results in being selected as an operator for the AI semiconductor project hosted by the Ministry of Science and ICT.

Since February, the government has selected seven business operators for the purpose of strengthening domestic cloud competitiveness through domestic AI semiconductor development and data center application.

The NIPA (National IT Industry Promotion Agency) announced the results of selecting operators for the AI voucher project and the high-performance computing support project. The A Voucher Project provides AI solution demand companies with the right to use (voucher) to purchase and use solutions from one of the domestic AI semiconductor companies.

Of the 31 companies finally selected that day, 15 companies announced that they would provide AI services using Furiosa AI's first-generation chip, Warboy.

In addition, among the 100 or so companies and institutions participating in the high-performance computing support project that provides computing resources for domestic AI semiconductor-based data centers to AI research and development companies, 60 companies are conducting business in the Furiosa AI-Kakao Enterprise consortium.

In addition, Furiosa AI is participating in the Naver Cloud and AI semiconductor farm construction and verification and AI semiconductor test verification environment creation projects.

Meanwhile, Furiosa AI's first-generation chip, Warboy, is being mass-produced as an AI semiconductor for the first time in Korea at Samsung Foundry through design house Semifive.

FuriosaAI CEO Baek Jun-ho said, “This is a result that proves the commercialization competitiveness of our first-generation chip, Warboy. We will use this national project as an opportunity to respond to a wider range of customers and services by advancing the SW stack, including the compiler, and expanding usability, and quickly securing the global competitiveness of our products.”