The on-device AI battle is taking place at CES 2024. Global companies, chipmakers, and startups are all showcasing edge AI solutions, marking the beginning of the AI competition.

DeepX, an AI semiconductor source technology company, unveiled four AI semiconductors for on-device AI, the 'All-in-one AI Total Solution', at CES 2024 on the 9th: △Physical Security System △Machine Vision △Smart Mobility △Robot Platform △AI Server.

DeepX will open a standalone booth at CES 2024, and will be unprecedented among global AI semiconductor development companies in simultaneously presenting four AI semiconductors that can be applied from small sensors to AI servers, as well as DXNN, a development environment that can run four heterogeneous semiconductors with a single software framework.

Since its inception, DeepX has been targeting the market with a strategy focused on responding to the fragmented on-device AI market. Accordingly, we are moving to take the lead in the market by focusing on providing customized solutions optimized for our customers' products.

DeepX's 'All-Info AI Total Solution' consists of △DX-V1 △DX-V2 △DX-M1 △DX-H1.

The DX-V1 and DX-V2, which are specialized in vision systems, are stand-alone-based chips. The DX-V1 can process the latest AI algorithms such as Yolov7 from a single camera, while the DX-V2 is specialized for autonomous driving and robot vision that require 3D sensor processing in addition to the camera.

The DX-M1 supports real-time AI processing at over 30 FPS for multi-channel images of 16 or more channels with a single chip, and the DX-H1 for AI servers is an AI inference solution that maximizes performance, power, and cost efficiency compared to GPGPUs dedicated to AI inference.

DeepX is running an Early Engagement Customer Program (EECP) program and is currently running a promotion that allows users to quickly experience the small camera module, a single-chip solution equipped with the DX-V1, the M.2 module equipped with the AI accelerator solution DX-M1, and DeepX's developer environment, DXNN.

It is currently being provided to around 40 global customers and is undergoing a pre-verification stage before mass production, and it is expected that mass-produced chips will be released in the second half of this year and installed in customers' products next year, which will contribute to the popularization of on-device AI.

DeepX CEO Kim Nok-won said, “Since its founding, DeepX has declared that it will develop the world’s best AI semiconductor source technology and lead the global market. To achieve that goal, a small number of DeepX members have made great sacrifices and put in great effort to simultaneously launch four AI semiconductors and secure ultra-gap technologies.”
> He also said, “All of DeepX’s first-generation products have won CES Innovation Awards and have been released to the global market, and are preparing for mass production,” and “We are also planning new products that will open up new markets in the future.”