FNS Electronics (CEO Choi Byeong-cheol and Shin Jae-ho), a high-performance semiconductor glass substrate manufacturing company, has begun mass producing and exporting semiconductor glass substrates, and has stepped into the global leadership of glass substrates.

FNS Electronics announced on the 16th that it will ship its first mass-produced glass substrates on the 16th and export them to Absolics.

On the 16th, FNS Electronics held its first shipment and export ceremony at its Songdo headquarters in Incheon, attended by CEOs Choi Byeong-cheol and Shin Jae-ho and CEO Oh Jun-rok of Absolix.

FNS Electronics supplies glass substrates using its own process technology to the Absolix plant located in Covington, Georgia, USA.

Absolix is a subsidiary established by SKC in 2021 for the semiconductor glass substrate business for high-performance computing.

FNS Electronics succeeded in mass producing semiconductor glass substrates using glass-through-voltage (TGV) and metallizing technology, which forms metal layers, for the first time in the world this year, and has now paved the way for its first mass export.

Glass substrates are an innovative substrate material that can directly connect semiconductor chips and main boards. It has a smooth surface and excellent processability into large square panels, making it suitable for implementing ultra-fine line width semiconductor packaging.

Additionally, since there is no need for an intermediate substrate (silicon interposer), the substrate thickness can be reduced by 25%, and power consumption can be reduced by more than 30% compared to other materials used in the packaging area.

Founded in 2021, FNS Electronics established an R&D center in Gumi, Gyeongbuk in the same year and has secured global-level competitiveness through the development of core glass substrate manufacturing technologies. This year, it succeeded in mass-producing semiconductor glass substrates, and its high technological prowess and production capacity were recognized. FNS Electronics’ glass substrate factory is located in Songdo, and additional equipment and personnel will be invested to improve yields at the mass production plant and establish a mass production system.

FNS Electronics has recently attracted large-scale investments from various investment companies in recognition of its advanced technology and outstanding mass production capabilities. The investment will be used to expand excellent human resources and equipment, develop technology, and expand into the global market.

TGV is a technology that transmits electrical signals by drilling tiny holes in a glass substrate, and is the core of the glass substrate mass production process. Metallization is a process of forming a metal film on a substrate, and provides excellent adhesion through high purity and density. FNS Electronics is currently the only company in the world that manufactures glass substrates using the TGV and metallization processes.

Choi Byeong-cheol, CEO of F&S Electronics, said, “Glass substrates are an innovative technology that will change the landscape of semiconductor packaging, and most global semiconductor companies are considering introducing them.” He added, “This first export is a result that recognizes F&S Electronics’ core glass substrate process technology capabilities, and is evaluated as an important stepping stone for advancing into the global market in the future. “We will continue to secure domestic and international customers and lead the global glass substrate market in the future,” he said.