DeepX (CEO Nok-won Kim) is starting to enter the global market in earnest by starting mass production of AI semiconductors.

DeepX announced on the 25th that it will receive the first mass-produced wafers for AI semiconductors using Samsung Electronics' 5nm process later this year.

According to DeepX, the target yield is 91-94%, and it recorded a yield of 87% based on sample chips previously produced by MPW, and it stated that yield optimization is in progress based on this.

In addition, we plan to maximize stability by applying a high-reliability mass production test called 'SLT (System-Level Test)' to all products.

DeepX has participated in more than 20 overseas exhibitions per year, including CES, Computex Taipei, and MWC, and showcased world-class AI semiconductors.

As a result, we have received product evaluation requests from over 200 global companies including those in China, the United States, and Europe, and are currently discussing collaboration with various companies at home and abroad.

DeepX has applied for over 300 AI semiconductor-related patents worldwide, and holds the largest number of original patents among global AI semiconductor companies.

Additionally, it achieved the feat of winning three CES Innovation Awards and being selected as the '2024 Global AI Semiconductor Industry Company of the Year.'

DeepX will deliver its first mass-produced products to global customers early next year.Prior to that, we plan to conduct joint promotions with our partners.

DeepX plans to demonstrate its technological prowess at CES 2025 by presenting a demo of its application products in collaboration with LG Uplus, POSCO DX, and Hyundai Motor Robotics Lab.

Through this, it is expected to establish a unique position in the global market.

Kim Nok-won, CEO, said, “The DX-M1 product has the technology to satisfy all three core values of semiconductors: price competitiveness, computational performance, power consumption, and heat generation control.”