▲CEO Song Jae-hyuk giving a keynote speech at SEMICON Korea 2025.
Semiconductors, AI Innovation in 'Speed and Power Efficiency' Is Necessary
Advanced Packaging 'Chiplet', "No Way Without Collaboration "
“Semiconductor technology that can mimic human brain functions will become essential for AI technology.”
In his keynote speech at SEMICON Korea 2025, Samsung Electronics President Song Jae-hyuk emphasized the future outlook and the importance of the semiconductor ecosystem under the theme of semiconductors for a better life.
President Song said, “Semiconductors are pursuing these two values,” and “This is because AI technology can catch up with the human brain’s target point only when semiconductor speed is increased and power is reduced,” revealing the importance of semiconductor technology.
Emphasizing the importance of semiconductor technology as an essential element in implementing AI technology, he suggested that while semiconductors are evolving toward targeting the human brain, there are still challenges in terms of power efficiency and response speed.
As semiconductor microfabrication processes reach their limits, the semiconductor industry is entering a new chapter after trying various methods of processing and packaging, such as packaging, chiplets, and vertical stacking.
President Song Jae-hyeok said, “Technological developments that used to take two years are now becoming more difficult to achieve, taking two to three years,” but added, “Packaging technology is advancing our technological limits a little further.” “We believe that we can lead the future with 3D structures, new material applications, etc.”
It is expected that the advancement of semiconductor technology will not only affect AI technology, but will also spread to various industrial technologies such as agriculture and medicine, and drive innovation across industries. It is also positive that science and technology will be able to overcome the recently emerging energy supply and demand problem.
In particular, chiplet technology, which combines various heterogeneous chips into one, is becoming the standard for advanced semiconductors as it becomes the trend of advanced packaging. President Song emphasized, “△Collaboration between research institutes and companies in design, materials, and EDA is important to create chiplets together.”