AI Agents Trigger 'Memory Supercycle'
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ASML, TSMC, and Samsung Play the '12-inch Photomask' Card…40-Year Semiconductor Standard Changes
ASML, TSMC, Samsung Electronics, and Intel have begun a joint industry standard transition in the era of High NA EUV, now pointing in the same directi…
2026.09.09 by 배종인 기자
TSMC·ASML Promote Transition to 12-inch Photomasks for High NA EUV...Target Mass Production in 2033
TSMC and ASML announced on the 8th that they have launched a joint industry initiative for transitioning to 12-inch photomasks for High NA EUV. The tw…
2026.09.09 by 배종인 기자
Intel Foundry and ASML Achieve Breakthrough in High NA EUV Application to Over 1 Million Wafer Processes
Intel Foundry and ASML have disclosed their mass production achievements with High NA EUV lithography technology. To date, High NA EUV has been applie…
2026.09.08 by 배종인 기자
Samsung Electronics Expands High NA EUV and 12-inch Mask Collaboration with ASML
Samsung Electronics is expanding its collaboration with ASML to secure next-generation lithography technology. The company is pursuing joint developme…
2026.09.08 by 배종인 기자
ZEISS Appoints Dr. Jaane Seehusen as New Korea Regional Director
Global optical company ZEISS has appointed Dr. Jaane Seehusen, Head of Supply Chain Management for the Semiconductor Business Unit, as the new regiona…
2026.09.04 by 배종인 기자
820 trillion won super budget focused on AI, semiconductors, and power grids
The government is compiling a 820 trillion won super budget for 2027 and concentrating finances on industrial policy that positions AI, semiconductors…
2026.09.02 by 배종인 기자
EVG Supports Resolution of CPO Manufacturing Challenges for AI Data Centers
As the importance of CPO (Co-Packaged Optics), a high-bandwidth and low-power optical interconnect technology, grows with expanding AI data center dem…
2026.09.02 by 배종인 기자
Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar…
2026.08.31 by 배종인 기자
Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM…
2026.08.28 by 배종인 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and effici…
2026.08.28 by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West…
2026.08.28 by 배종인 기자
Lam Research Breaks Ground on New R&D Facility in Oregon
Lam Research held a groundbreaking ceremony for a new R&D center at its Tualatin campus in Oregon to respond to growing demand for AI semiconductor de…
2026.08.28 by 배종인 기자
Gartner "Memory Sales to Reach $837.3 Billion in 2026… 280% Year-over-Year Surge"
Gartner forecasts that the global semiconductor market will reach $1.5552 trillion in 2026. Expansion of AI infrastructure investment and memory price…
2026.08.25 by 명세환 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
The Future Opened by the Convergence of Light and Semiconductors…'Optical Science and Optical Semiconductor Workshop 2026' Held in Suwon
The 'Optical Science and Optical Semiconductor Workshop 2026' addressing light and semiconductor convergence technologies will be held on September 17…
2026.08.21 by 배종인 기자