Field-proven 'ST8500 Programmable
Multi-protocol SoC' and 'ultra-low power sub-GHz'
Turnkey solution based on 'S2-LP RF transceiver'


The G3-PLC hybrid specification enables smart grid, smart city, and industrial/IoT devices to automatically/dynamically select appropriate wireless and power line channels depending on network conditions.

STMicroelectronics announced on the 17th that its 'ST8500 and S2-LP chipset' was the first to obtain G3-PLC hybrid certification, which specifies connectivity between powerline and wireless media.

ST demonstrated its ST8500 hybrid chipset at the G3-PLC Alliance interoperability plugfest in 2020. The chipset is the first product to complete the latest G3-PLC certification scheme announced in March 2021, along with hybrid profile testing.

The certified chipset comprises the ST8500 programmable multiprotocol powerline communication SoC, the ‘STLD1’ line driver, and ST’s S2-LP ultra-low-power sub-GHz radio transceiver. Software-defined SoC programming capabilities support a portfolio of powerline protocol stacks for global frequency bands including CENELEC and FCC.

The ST8500 powerline communication SoC platform is widely used in industrial and infrastructure applications. The new ST hybrid turnkey solution is already in use by key stakeholders in the smart grid market. ST’s hardware and firmware solutions have also been selected to power the official RF certification test equipment of the G3-PLC Alliance.

The ST8500 SoC is available in a 7x7x1mm QFN56 package, while the STLD1 and S2-LP are available in a 4x4x1mm QFN24 package. For pricing and sample requests, please contact your ST Korea office.