Nanosheet transistors introduced to replace FinFET
Trial production in 2023, mass production in 2024
The competition to secure the world's best semiconductor technology is intensifying as TSMC receives approval from the Taiwanese government for its 2nm plan the day after Intel announced its CPU roadmap.
According to Taiwanese and Chinese media, TSMC has recently obtained approval from the Taiwanese government for its 2nm new facility plan. In particular, this approval came right after Intel announced its CPU roadmap, and is interpreted as an intention for TSMC to continue to take the lead in the latest process.
The biggest feature of TSMC's 2nm process is that it replaces the current FinFET structure by introducing nanosheet transistors. This reportedly allows for better control of threshold voltage and allows chip design with a clock rate lowered by at least 15%, significantly improving performance.
TSMC's 2nm process is scheduled for trial production in 2023 and mass production in 2024.
Meanwhile, Intel recently announced its CPU roadmap, announcing 20A and 18A. It is expected that 20A and 18A will be at a similar level to TSMC's 2㎚, and the competition between Intel and TSMC for the best semiconductor technology is expected to be fierce.