ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, is introducing new equipment for compound semiconductor manufacturing, addressing growing demand in the compound semiconductor market for electric vehicles, 5G communications, RF, and artificial intelligence.

ACM Research announced on the 4th that it recently launched a new series of comprehensive equipment for compound semiconductor manufacturing.

ACM's 150mm-200mm bridge systems support front-end cleaning and a wide range of WLP applications for compound semiconductors, including gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC) processes.

The compound semiconductor wet process portfolio includes coaters, developers, photoresist (PR) strippers, wet etching equipment, cleaning equipment, and metal plating equipment, and features automated systems for flat or notched wafers.

“The compound semiconductor industry is growing rapidly due to increasing demand from various markets,” said Dr. David Wang, President and CEO of ACM. “ACM is leveraging its expertise and technology in front-end and WLP series products to address specific technologies in compound semiconductors.” "We are providing high-performance and cost-effective systems for the needs of compound semiconductors. The compound semiconductor capital equipment market presents significant growth opportunities for ACM, as GaAs, GaN, and SiC devices are becoming increasingly essential components of future electric vehicles, 5G communication systems, and artificial intelligence solutions."