ACM Supplies First 300mm Wafer Cleaning Equipment to Singapore Foundry Production Line
ACM Research has delivered its first 300mm single-wafer cleaning system to a multinational foundry customer's front-end-of-line wafer fab in Singapore…
2026.03.31 by 배종인 기자
ACM Dramatically Improves Wet Etching Uniformity and Cleaning Performance
ACM Research, Inc., a global leader in semiconductor and advanced wafer-level packaging (WLP) process solutions, has achieved breakthrough improvement…
2025.08.05 by 배종인 기자
ACM Research Wins 2025 3D InCites Technology Enablement Award
ACM Research recently won the 2025 3D InCites Technology Enablement category award, receiving recognition for its outstanding technological capabiliti…
2025.04.22 by 배종인 기자
ACM, ALD process qualified for 300mm semiconductor mass production
ACM Research, Inc. has received process qualification certification from customers for its 300mm atomic layer deposition (ALD) furnace equipment for s…
2024.12.12 by 배종인 기자
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ACM Expands Fan-Out Panel-Level Packaging Portfolio
ACM Research, a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has launched t…
2024.09.13 by 배종인 기자
ACM Research Enters Fan-Out Panel-Level Advanced Packaging Market
ACM Research, Inc., a specialist in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has achieved e…
2024.08.07 by 배종인 기자
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ACM Research Sells Ultra C Equipment for SiC Cleaning
ACM Research, Inc., a specialist in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has entered th…
2023.04.21 by 배종인 기자
ACM Enters Cotter/Developer Track Market
ACM Research, Inc., a specialist in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has entered th…
2022.11.25 by 배종인 기자
ACM Launches New ALD Furnace Products
Thermal atomic layer deposition (thermal ALD) is a rapidly growing technology in advanced node processes, and as logic nodes continue to shrink, semic…
2022.10.14 by 명세환 기자
ACM Launches New Post-CMP Cleaning Equipment
Amid rising lead times in the global equipment supply chain, ACM Research is expanding its cleaning equipment portfolio by launching a new post-CMP cl…
2022.08.11 by 명세환 기자
ACM, Ultra ECP AP Bulk Supply Agreement
ACM Research has successfully concluded a mass supply contract for its high-speed electroplating equipment 'Ultra ECP ap'.
2022.05.19 by 배종인 기자
ACM Secures Order for 29 Ultra C Wet Bench Units… Largest in Company History
ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, has reco…
2022.02.24 by 배종인 기자
ACM Launches Compound Semiconductor Equipment
ACM Research, Inc., a leading company in wafer processing solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, has launc…
2022.02.07 by 배종인 기자
ACM wins first order from Chinese IDM
ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, has secu…
2021.11.23 by 강정규 기자
ACM Receives ECP Demo Equipment Order from Major IC Manufacturer
ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, is activ…
2021.11.16 by 배종인 기자