Infineon Technologies (hereafter Infineon) supplies chipsets consisting of IGBTs and diodes to Semikron Danfoss.

Infineon announced on the 25th that it has signed a contract with Semikron Danfoss to supply silicon-based e-mobility chips.

Analysts forecast that by 2028, vehicles with fully or partially electric drivetrains will account for two-thirds of new vehicle production, and this growth in e-mobility is driving demand for power semiconductors.

Infineon responds to this trend by supplying chips used in power modules for inverters in electric vehicle main drives to Semikron Danfoss.

The IGBTs and diodes supplied to Semikron Danfoss are produced at Infineon’s Dresden, Germany, and Kulim, Malaysia, plants.

Semikron Danfoss manufactures power modules for vehicles in Nuremberg and Flensburg, Germany, Utica, USA, and in Nanjing, China, starting in 2024.

“Infineon’s IGBTs and diodes are already playing a key role in the transition to e-mobility by enabling efficient power conversion in electric powertrains,” said Peter Schiefer, President of Infineon’s Automotive Division. “With our broad product portfolio, system expertise and continuous investments in our manufacturing facilities, Infineon is a strong partner for automotive suppliers like Semikron Danfoss.”

Clara“Semikron Danfoss manufactures power modules using cutting-edge assembly technology that maximizes the capabilities of IGBTs and diodes, thereby contributing to the decarbonization of the transportation sector,” said Claus A. Petersen, President of Semikron Danfoss.