A public-private joint cooperation system will be established to secure leading semiconductor packaging technology.

The Ministry of Trade, Industry and Energy (Minister Lee Chang-yang) held a business agreement ceremony at the L Tower in Seoul on the 29th to develop advanced semiconductor packaging technology through public-private cooperation to secure competitiveness in the semiconductor advanced packaging industry.

On this day, semiconductor demand companies such as Samsung Electronics, SK Hynix, LG Chem, Hana Micron, Protec, Sapion Korea, Simtek, Next-Generation Intelligent Semiconductor Division, Korea Semiconductor Industry Association, Korea Industrial Technology Evaluation and Planning Institute, small and medium-sized businesses, semiconductor post-processing specialists (OSAT), and fabless companies participated in the event and signed an ‘Agreement on Cooperation in Development of Advanced Semiconductor Packaging Technology.’

In addition, they agreed to actively cooperate to secure advanced semiconductor packaging technology and foster the semiconductor post-processing industry by establishing a virtuous cycle ecosystem for advanced packaging.

Advanced packaging has emerged as a key technology due to the increased demand for multi-functional, highly integrated semiconductors to implement low power and high performance in accordance with the digital transformation, as well as the need to overcome the limitations of semiconductor process miniaturization technology and to integrate individual devices into a single package.

The Ministry of Trade, Industry and Energy is promoting new research and development (R&D) related to advanced packaging to enter the changing packaging market in a timely manner, and is working with industry-academia-research experts to level up the system semiconductor industry by securing technological leadership in the global semiconductor advanced packaging industry.We are preparing a large-scale R&D project for ‘development of advanced semiconductor packaging technology.’

We plan to actively reflect the demands of companies such as foundries and integrated device manufacturers (IDMs) to develop high-integration, high-function, low-power advanced packaging super-gap technologies, secure core technologies from domestic small and medium-sized enterprises and OSAT companies, and establish a collaborative system with semiconductor research institutes in the US and EU and global OSAT companies to secure next-generation technologies.

Joo Young-joon, Director of the Industrial Policy Office, said, “In order to secure leading global semiconductor advanced packaging technology, we ask for active cooperation in technology development and bold investment from companies,” adding, “The government will also spare no support and cooperation to strengthen the competitiveness of semiconductor packaging technology and create a robust ecosystem in line with the industry’s efforts.”