SK Hynix "No Confirmed Matters Related to Solidigm"
SK Hynix stated that there are currently no confirmed matters regarding capital utilization plans related to Solidigm, and all decisions will be made …
2026.10.01 by 배종인 기자
Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM…
2026.08.28 by 배종인 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and effici…
2026.08.28 by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West…
2026.08.28 by 배종인 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
[EDA Great Transformation ③] Korea Was Already in the Midst of the EDA War
Competition among global EDA companies is intensifying in the Korean market, centered on Samsung's 2nm and HBM and 3D stacking. AI-based design automa…
2026.08.12 by 배종인 기자
SK Hynix Decides on 54 Trillion Won Investment in Yongin Y2 and Cheongju M17
SK Hynix will invest a total of 54 trillion won in Yongin and Cheongju to construct new semiconductor fabs in response to expanding AI demand. The Yon…
2026.08.10 by 배종인 기자
SanDisk Unveils AI Inference Technologies Including HBF™ and BiCS10 NAND at FMS 2026
SanDisk disclosed next-generation technologies for AI inference workloads at FMS 2026. The company showcased BiCS10 QLC NAND and a new HBF™ (High Band…
2026.08.06 by 명세환 기자
SK Hynix and SanDisk Unveil First HBF Standard Specification…Presenting AI Memory Strategy at FMS 2026
SK Hynix and SanDisk have unveiled the first standard specification for HBF (High Bandwidth Flash). Finalized within six months, this specification su…
2026.08.05 by 배종인 기자
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SK Hynix Introduces 'Half-Day In-depth Interview'... Reorganizes Recruitment Based on AI Competency
SK Hynix will begin new continuous recruitment starting August 20 and has completely restructured its hiring system centered on AI utilization capabil…
2026.07.30 by 배종인 기자
SK Hynix Reports Record-High Q2 Revenue of 79 Trillion Won and Operating Profit of 60 Trillion Won
SK Hynix achieved record-breaking results for the second quarter of 2026. The company recorded revenue of 79 trillion won and operating profit of 60 t…
2026.07.29 by 배종인 기자
AMD, “The Battle in the AI Era Is Now About Systems, Not Chips”… Analysis of 'Advancing AI 2026'
AMD entered into a full-stack competitive structure with NVIDIA by unveiling the MI455X-based Helios rack-scale AI solution through the 'Advancing AI …
2026.07.24 by 배종인 기자
SK Hynix Lists NASDAQ ADRs… Trading Begins in New York
SK Hynix, a leader in the artificial intelligence (AI) semiconductor market, has entered the US NASDAQ as it makes a strategic push into global capita…
2026.07.12 by 배종인 기자
Honam Emerges as 'Second Semiconductor Axis'... Samsung and SK Launch 800 Trillion Won Memory Cluster
Samsung and SK Hynix announced ambitious domestic investment plans on the 29th through the "Republic of Korea Great Leap Forward 3 Megaproject Nationa…
2026.06.29 by 배종인 기자
Rapid Growth of the AI Agent Market: Benefits Spreading to Semiconductor, Cloud, and Power Industries Amidst Competition for Data, Context, and Security-Based Infrastructure
The artificial intelligence (AI) market is transitioning from a conventional application-centric structure to an "agent-centric" structure that autono…
2026.06.23 by 배종인 기자