Cadence Design Systems announced today a broad collaboration with Samsung Foundry on the development of technologies to accelerate AI and 3D-IC semiconductor designs, including Samsung’s cutting-edge Gate All Around (GAA) node.

Cadence continues to collaborate with Samsung Electronics to develop application systems and semiconductors for AI, automotive, aerospace, HPC, and mobile.

The two companies minimized the leakage power of the 'SF2 GAA Platform' based on Cadence.AI. Cadence performed 'Cadence® Cerebrus Intelligent Chip Explorer' and AI design technology co-optimization (DTCO: Design Technology Co-Optimization).

Cadence said, “Compared to power supplies with the highest performance standards, Cadence.AI reduced leakage power by more than 10 percent.”

Through this collaboration, Cadence supports Samsung Foundry’s solutions for MDO. 'Cadence.AI Virtuoso Studio' was utilized in the analog circuit process transfer process.

Cadence’s PCIe 6.0 PHY IP on the Samsung SF5A successfully achieved PCIe 5.0 x8 compliance certification, further demonstrating seamless interoperability with other PCIe 5.0/6.0 systems and test equipment, further demonstrating the completeness of the PCIe solution.

We are strengthening our collaboration with Samsung Foundry by designing advanced memory IP for GDDR7 on Samsung SF4X and SF2 and helping to reshape the HPC/AI industry with these new memory standards.

“We are honored to collaborate with Samsung to provide advanced technologies to our mutual customers designing the next generation of intelligent systems,” said Tom Beckley, senior vice president and general manager of Cadence’s Custom IC & PCB Group. “The hyper-convergence of AI and modern accelerated computing requires a robust silicon infrastructure. “This new AI-based, certified design flow and standardized solution will enable our mutual customers to confidently design for Samsung’s advanced nodes, while also achieving their own design and time-to-market goals,” he explained.

“Samsung Electronics and Cadence are working closely together to advance technologies and help our mutual customers create competitive designs in the market,” said Hyung-Ok Kim, senior vice president of Design Technology at Samsung Electronics’ Foundry Business Unit. “We are helping our mutual customers overcome the limitations of cutting-edge AI, HPC, and mobile SoC designs by leveraging Samsung’s latest processes and technological innovations.”

Samsung Electronics held the Samsung Foundry Forum and Safe Forum 2024 at COEX on the 9th. Choi Si-young, president of Samsung Electronics' Foundry Business Division, said in his keynote speech that day, "Samsung Electronics is supporting various specialty process technologies in addition to advanced processes to cooperate with domestic fabless customers." He added, "Samsung will provide customers with the AI solutions they need most by converging specialty solutions such as BCD that increases AI power efficiency and high-sensitivity sensor technology that improves the accuracy of edge devices."