Global optics company Zeiss Korea (CEO Jeong Hyeon-seok) is introducing to the public an innovative technology that enhances efficiency in the semiconductor packaging field through technological automation and precision inspection.

Zeiss announced that it will participate in the 18th Next Generation Semiconductor Packaging Equipment and Materials Industry Exhibition (ASPS 2024) to be held at the Suwon Convention Center from August 28th to 30th.

The ZEISS Group is a leading German optics company with a history of over 175 years, starting with the microscope of its founder, Carl Zeiss. At this exhibition, it will present innovative solutions optimized for the semiconductor packaging field.

At this exhibition, ZEISS Korea will unveil cutting-edge technologies that will lead innovation in the semiconductor packaging process, centering on the X-ray microscopes ZEISS Xradia 630 Versa, ZEISS Xradia 810 Ultra, and ZEISS Crossbeam 550 f/s Laser.

In particular, the Xradia 630 Versa and Xradia 810 Ultra support effective discovery and resolution of various defect issues that may occur during the semiconductor packaging process through high-resolution imaging and in-depth analysis.

ZEISS X-ray microscopy (XRM) solutions enable precise inspection of wafer internal defects and structures through 3D non-destructive analysis, and semiconductor It can significantly improve production efficiency.

Additionally, Zeiss' solutions are designed to be flexibly utilized in various inspection environments, which can also contribute to improving workflows within semiconductor processes.

ZEISS will also hold a technology seminar on packaging at ASPS 2024. Moshe Preil, Sr. Technical Manager of Product Strategy Semiconductor Manufacturing Technology, a packaging solutions expert in the Semiconductor Division of ZEISS Group Headquarters, will attend and present the seminar.

The presentation topic is ‘Rapid 3D X-ray Wafer-level Inspection of Interconnects in Advanced Packaging’, and ZEISS will explain the packaging solutions it is currently researching and developing.

This content is being presented for the first time in Korea and will be held in the seminar room inside the exhibition hall from 3 to 4 PM on August 28th.

“This ASPS 2024 exhibition will be an opportunity to see what value ZEISS solutions can add to the semiconductor packaging field, a hot topic in the industry,” said Choi Wook, Executive Director in charge of the Microscope Business Unit at ZEISS Korea. “We hope that through ZEISS’s technological know-how and expertise, ZEISS will be recognized as a technology partner for R&D and technological advancement in the Korean semiconductor packaging field.”

Through its participation in this exhibition, ZEISS Korea is strengthening its continued support and technological innovation for the Korean semiconductor industry and solidifying its commitment to being at the center of future technological development.