AI semiconductor company DeepX announced on the 25th that it plans to further expand its business by starting mass production chip supply in earnest.

It was announced that starting on the 3rd of next month, they will participate in the Mobile World Congress (MWC) held in Barcelona, Spain and demonstrate an on-device AI solution utilizing DeepX's first-generation chip together with LG Uplus. We plan to operate an independent booth to reveal the roadmap for the DX-M2, an on-device AI semiconductor for large-scale language models.

In addition, at Embedded World, which will be held in Nuremberg, Germany from the 11th, solutions equipped with DeepX products will be exhibited at the booths of global partners such as Micron and Raspberry Pi, and a DeepX independent booth will also be operated to conduct business consultations with potential customers.

In addition, the company announced that it plans to participate in ISC West, a professional physical security industry exhibition in the U.S. in April, and Computex Taipei in Taiwan in May, seeking to apply and expand AI chips in various fields.

DeepX said that approximately 16,000 visitors visited its booth at CES 2025, the world's largest electronics show, last month, and that more than 100 customers requested mass-production chip samples.

This exhibition showcased a variety of application cases from global companies related to edge devices such as smart cities, smart factories, and robots equipped with mass-produced products, as well as industrial equipment and edge servers.

DeepX revealed that Hyundai Motor Company Robotics Lab's AI algorithm for robots, Taiwan Inventec's AI algorithm for industrial use, POSCO DX's AI algorithm for factory automation and logistics automation, and LG Uplus' AI algorithm based on vision language model for industrial sites and city safety are running on DeepX's mass-produced products.